Ryan B. Sills , Xiaowang W. Zhou , Michael E. Foster
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引用次数: 0
摘要
针对 FCC Fe0.70Cr0.20Ni0.10(接近 300 系列不锈钢),在一定的空腔间距、直径、压力和滑行面位置范围内,确定了边缘和螺旋位错切割空腔和 He 气泡(一般称为空腔)的临界应力。与障碍硬化的经典理论相比,结果显示了间距、直径和压力的异常趋势。这些反常现象归因于弹性各向异性和低堆积断层能金属中宽扩展位错核心,表明在各向同性固体中使用完美位错研究空洞和气泡硬化时必须谨慎。在许多使用螺钉位错的模拟中,我们观察到空隙/气泡表面存在交叉滑移,这导致了对强化的额外贡献。我们将这种现象称为空腔交叉滑移锁定,并认为它可能是空洞和气泡硬化的一个重要因素。
Void and helium bubble interactions with dislocations in an FCC stainless steel alloy: anomalous hardening and cavity cross-slip locking
The critical stress for cutting of a void and He bubble (generically referred to as a cavity) by edge and screw dislocations has been determined for FCC Fe0.70Cr0.20Ni0.10—close to 300-series stainless steel—over a range of cavity spacings, diameters, pressures, and glide plane positions. The results exhibit anomalous trends with spacing, diameter, and pressure when compared with classical theories for obstacle hardening. These anomalies are attributed to elastic anisotropy and the wide extended dislocation core in low stacking fault energy metals, indicating that caution must be exercised when using perfect dislocations in isotropic solids to study void and bubble hardening. In many simulations with screw dislocations, cross-slip was observed at the void/bubble surface, leading to an additional contribution to strengthening. We refer to this phenomenon as cavity cross-slip locking, and argue that it may be an important contributor to void and bubble hardening.
期刊介绍:
Materialia is a multidisciplinary journal of materials science and engineering that publishes original peer-reviewed research articles. Articles in Materialia advance the understanding of the relationship between processing, structure, property, and function of materials.
Materialia publishes full-length research articles, review articles, and letters (short communications). In addition to receiving direct submissions, Materialia also accepts transfers from Acta Materialia, Inc. partner journals. Materialia offers authors the choice to publish on an open access model (with author fee), or on a subscription model (with no author fee).