An Efficient LBFEM-POD Scheme for Transient Thermomechanical Simulation of Electronic Packages

In this article, we present an efficient Laguerre-based finite element method with proper orthogonal decomposition (LBFEM-POD) for transient thermomechanical analysis of electronic packages. In the match-on-in-order scheme, we utilize a new type of basis function composed of three adjacent Laguerre polynomials, which successfully eliminates the accumulation terms in the traditional Laguerre-based method. By combining with the POD technique, the proposed method effectively reduces the order of thermomechanical model, enabling rapid prediction of temperature and thermal stress responses within the Laguerre domain. The accuracy and efficiency of the LBFEM-POD method are demonstrated by several numerical examples.