{"title":"利用固化动力学模型和实验分析预测碳纤维复合材料微波固化过程中的温度分布","authors":"Hussain Badshah, Rajeev Kumar, Parmod Kumar, Sunny Zafar","doi":"10.1007/s10443-024-10257-6","DOIUrl":null,"url":null,"abstract":"<div><p>In this work, a numerical model was developed to investigate the layer wise temperature distribution during microwave curing to manufacture carbon fiber composites using COMSOL Multiphysics<sup>®</sup> software package. A multivariable nonlinear regression analysis was conducted to acquire the cure kinetics parameters based on the heating rate. The resulting model demonstrated temperature and percentage degree of cure prediction accuracy within an error margin of 6% and 0.62%, respectively. In addition, a comparison was made between the contour of temperature distribution across different layers. The correlation with experimental and simulation data revealed that uniform heating occurred at 180 W due to a longer cycle time compared to power levels of 360 W, 540 W, and 720 W, in the presence of a standing wave. Conversely, the model indicated a temperature gradient of approximately 8.7 ℃, 10.2 ℃, 24.6 ℃, and 36.6 ℃ between the first and last layer for power levels of 180 W, 360 W, 540 W, and 720 W, respectively. Utilizing a dwell period of 65 s at a temperature of 100 ℃, the gradient between the first and last layer reduced to approximately 5.21 ℃, 7.97 ℃, 8.91 ℃, and 9.04 ℃ for power levels of 180 W, 360 W, 540 W, and 720 W, respectively, at the end of the curing process. Furthermore, a comparative examination of temperature distribution and degree of cure at 180 W revealed a higher degree of cure in regions where the temperature was elevated due to the standing wave.</p><h3>Graphical Abstract</h3><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":468,"journal":{"name":"Applied Composite Materials","volume":null,"pages":null},"PeriodicalIF":2.3000,"publicationDate":"2024-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Cure Kinetic Modelling and Experimental Analysis to Predict Temperature Distribution during Microwave Curing of Carbon Fiber Composites\",\"authors\":\"Hussain Badshah, Rajeev Kumar, Parmod Kumar, Sunny Zafar\",\"doi\":\"10.1007/s10443-024-10257-6\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>In this work, a numerical model was developed to investigate the layer wise temperature distribution during microwave curing to manufacture carbon fiber composites using COMSOL Multiphysics<sup>®</sup> software package. A multivariable nonlinear regression analysis was conducted to acquire the cure kinetics parameters based on the heating rate. The resulting model demonstrated temperature and percentage degree of cure prediction accuracy within an error margin of 6% and 0.62%, respectively. In addition, a comparison was made between the contour of temperature distribution across different layers. The correlation with experimental and simulation data revealed that uniform heating occurred at 180 W due to a longer cycle time compared to power levels of 360 W, 540 W, and 720 W, in the presence of a standing wave. Conversely, the model indicated a temperature gradient of approximately 8.7 ℃, 10.2 ℃, 24.6 ℃, and 36.6 ℃ between the first and last layer for power levels of 180 W, 360 W, 540 W, and 720 W, respectively. Utilizing a dwell period of 65 s at a temperature of 100 ℃, the gradient between the first and last layer reduced to approximately 5.21 ℃, 7.97 ℃, 8.91 ℃, and 9.04 ℃ for power levels of 180 W, 360 W, 540 W, and 720 W, respectively, at the end of the curing process. Furthermore, a comparative examination of temperature distribution and degree of cure at 180 W revealed a higher degree of cure in regions where the temperature was elevated due to the standing wave.</p><h3>Graphical Abstract</h3><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":468,\"journal\":{\"name\":\"Applied Composite Materials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-08-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applied Composite Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10443-024-10257-6\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, COMPOSITES\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Composite Materials","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10443-024-10257-6","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, COMPOSITES","Score":null,"Total":0}
引用次数: 0
摘要
在这项工作中,使用 COMSOL Multiphysics® 软件包开发了一个数值模型,用于研究微波固化制造碳纤维复合材料过程中的层间温度分布。通过多变量非线性回归分析,获得了基于加热速率的固化动力学参数。结果表明,模型对温度和固化度百分比的预测准确度分别在 6% 和 0.62% 的误差范围内。此外,还对不同层的温度分布轮廓进行了比较。与实验和模拟数据的相关性表明,与 360 W、540 W 和 720 W 的功率水平相比,在存在驻波的情况下,由于周期时间较长,在 180 W 时会出现均匀加热。相反,模型显示,当功率水平为 180 W、360 W、540 W 和 720 W 时,第一层和最后一层之间的温度梯度分别约为 8.7 ℃、10.2 ℃、24.6 ℃ 和 36.6 ℃。在温度为 100 ℃、停留时间为 65 秒的情况下,在固化过程结束时,功率分别为 180 W、360 W、540 W 和 720 W 时,第一层和最后一层之间的温度梯度分别降至约 5.21 ℃、7.97 ℃、8.91 ℃ 和 9.04 ℃。此外,对 180 W 功率下的温度分布和固化程度进行的比较研究表明,在驻波导致温度升高的区域,固化程度更高。
Cure Kinetic Modelling and Experimental Analysis to Predict Temperature Distribution during Microwave Curing of Carbon Fiber Composites
In this work, a numerical model was developed to investigate the layer wise temperature distribution during microwave curing to manufacture carbon fiber composites using COMSOL Multiphysics® software package. A multivariable nonlinear regression analysis was conducted to acquire the cure kinetics parameters based on the heating rate. The resulting model demonstrated temperature and percentage degree of cure prediction accuracy within an error margin of 6% and 0.62%, respectively. In addition, a comparison was made between the contour of temperature distribution across different layers. The correlation with experimental and simulation data revealed that uniform heating occurred at 180 W due to a longer cycle time compared to power levels of 360 W, 540 W, and 720 W, in the presence of a standing wave. Conversely, the model indicated a temperature gradient of approximately 8.7 ℃, 10.2 ℃, 24.6 ℃, and 36.6 ℃ between the first and last layer for power levels of 180 W, 360 W, 540 W, and 720 W, respectively. Utilizing a dwell period of 65 s at a temperature of 100 ℃, the gradient between the first and last layer reduced to approximately 5.21 ℃, 7.97 ℃, 8.91 ℃, and 9.04 ℃ for power levels of 180 W, 360 W, 540 W, and 720 W, respectively, at the end of the curing process. Furthermore, a comparative examination of temperature distribution and degree of cure at 180 W revealed a higher degree of cure in regions where the temperature was elevated due to the standing wave.
期刊介绍:
Applied Composite Materials is an international journal dedicated to the publication of original full-length papers, review articles and short communications of the highest quality that advance the development and application of engineering composite materials. Its articles identify problems that limit the performance and reliability of the composite material and composite part; and propose solutions that lead to innovation in design and the successful exploitation and commercialization of composite materials across the widest spectrum of engineering uses. The main focus is on the quantitative descriptions of material systems and processing routes.
Coverage includes management of time-dependent changes in microscopic and macroscopic structure and its exploitation from the material''s conception through to its eventual obsolescence.