用于器件-电路协同设计的基于物理的 β-Ga2O3 MOSFET 紧凑型电热模型

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-08-06 DOI:10.1109/TCPMT.2024.3439337
Kai Zhou;Xuanze Zhou;Song He;Guangwei Xu;Lingfei Wang;Yibo Wang;Genquan Han;Shibing Long
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引用次数: 0

摘要

晶体管的电热耦合效应是功率电路优化的一个难题,特别是对于最近高性能但导热性低的新型材料,如β -氧化镓($\ β $ -Ga2O3)。$\beta $ -Ga2O3金属氧化物半导体场效应晶体管(mosfet)中电热耦合效应的自一致计算对于评估器件到电路级的热行为至关重要。在本文中,我们提出了一个基于物理的$\beta $ -Ga2O3 mosfet的紧凑型电热模型。分别基于表面电位、Ward-Dutton电荷分配方案和傅立叶热传导定律得到了电流、终端电荷和通道温度的解析解。此外,通过嵌入二阶RC热子电路,利用温度依赖性迁移率和器件功耗来耦合电学和热性能。通过实验数据和不同工艺条件下的三维有限元模拟,对模型进行了严格验证。特别地,校正后的模型用于评估衬底材料和厚度等工艺参数对升压变换器性能的影响,为设计-技术协同优化(DTCO)流程提供了设计空间。
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A Physics-Based Compact Electrothermal Model of β -Ga2O3 MOSFETs for Device-Circuit Co-Design
The electrothermal coupling effect on transistors is an intractableness of power circuits optimization, particularly for recent novel materials with high performance but low thermal conductivity, like beta-gallium oxide ( $\beta $ -Ga2O3). Self-consistent calculations of electrothermal coupling effect in $\beta $ -Ga2O3 metal-oxide–semiconductor field-effect transistors (MOSFETs) are essential to assess the thermal behavior from device to circuit level. In this article, we proposed a physics-based compact electrothermal model of $\beta $ -Ga2O3 MOSFETs. Analytical solutions of current, terminal charge, and channel temperature are obtained based on surface potential, Ward-Dutton’s charge-partitioning scheme, and Fourier’s heat conduction law, respectively. Moreover, temperature-dependence mobility and device power dissipation are employed to couple electrical and thermal properties by embedding a two-order RC thermal subcircuit. The model is rigidly verified by comparing against experimental data and 3-D-FEM simulations under different process conditions. Especially, the calibrated model is used to evaluate the effect of technology parameters such as substrate material and thickness on boost converter performance, providing design space in design-technology co-optimization (DTCO) flow.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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