Kai Zhou;Xuanze Zhou;Song He;Guangwei Xu;Lingfei Wang;Yibo Wang;Genquan Han;Shibing Long
{"title":"用于器件-电路协同设计的基于物理的 β-Ga2O3 MOSFET 紧凑型电热模型","authors":"Kai Zhou;Xuanze Zhou;Song He;Guangwei Xu;Lingfei Wang;Yibo Wang;Genquan Han;Shibing Long","doi":"10.1109/TCPMT.2024.3439337","DOIUrl":null,"url":null,"abstract":"The electrothermal coupling effect on transistors is an intractableness of power circuits optimization, particularly for recent novel materials with high performance but low thermal conductivity, like beta-gallium oxide (\n<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>\n-Ga2O3). Self-consistent calculations of electrothermal coupling effect in \n<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>\n-Ga2O3 metal-oxide–semiconductor field-effect transistors (MOSFETs) are essential to assess the thermal behavior from device to circuit level. In this article, we proposed a physics-based compact electrothermal model of \n<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>\n-Ga2O3 MOSFETs. Analytical solutions of current, terminal charge, and channel temperature are obtained based on surface potential, Ward-Dutton’s charge-partitioning scheme, and Fourier’s heat conduction law, respectively. Moreover, temperature-dependence mobility and device power dissipation are employed to couple electrical and thermal properties by embedding a two-order RC thermal subcircuit. The model is rigidly verified by comparing against experimental data and 3-D-FEM simulations under different process conditions. Especially, the calibrated model is used to evaluate the effect of technology parameters such as substrate material and thickness on boost converter performance, providing design space in design-technology co-optimization (DTCO) flow.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2231-2239"},"PeriodicalIF":3.0000,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Physics-Based Compact Electrothermal Model of β -Ga2O3 MOSFETs for Device-Circuit Co-Design\",\"authors\":\"Kai Zhou;Xuanze Zhou;Song He;Guangwei Xu;Lingfei Wang;Yibo Wang;Genquan Han;Shibing Long\",\"doi\":\"10.1109/TCPMT.2024.3439337\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The electrothermal coupling effect on transistors is an intractableness of power circuits optimization, particularly for recent novel materials with high performance but low thermal conductivity, like beta-gallium oxide (\\n<inline-formula> <tex-math>$\\\\beta $ </tex-math></inline-formula>\\n-Ga2O3). Self-consistent calculations of electrothermal coupling effect in \\n<inline-formula> <tex-math>$\\\\beta $ </tex-math></inline-formula>\\n-Ga2O3 metal-oxide–semiconductor field-effect transistors (MOSFETs) are essential to assess the thermal behavior from device to circuit level. In this article, we proposed a physics-based compact electrothermal model of \\n<inline-formula> <tex-math>$\\\\beta $ </tex-math></inline-formula>\\n-Ga2O3 MOSFETs. Analytical solutions of current, terminal charge, and channel temperature are obtained based on surface potential, Ward-Dutton’s charge-partitioning scheme, and Fourier’s heat conduction law, respectively. Moreover, temperature-dependence mobility and device power dissipation are employed to couple electrical and thermal properties by embedding a two-order RC thermal subcircuit. The model is rigidly verified by comparing against experimental data and 3-D-FEM simulations under different process conditions. Especially, the calibrated model is used to evaluate the effect of technology parameters such as substrate material and thickness on boost converter performance, providing design space in design-technology co-optimization (DTCO) flow.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"14 12\",\"pages\":\"2231-2239\"},\"PeriodicalIF\":3.0000,\"publicationDate\":\"2024-08-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10623831/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10623831/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A Physics-Based Compact Electrothermal Model of β -Ga2O3 MOSFETs for Device-Circuit Co-Design
The electrothermal coupling effect on transistors is an intractableness of power circuits optimization, particularly for recent novel materials with high performance but low thermal conductivity, like beta-gallium oxide (
$\beta $
-Ga2O3). Self-consistent calculations of electrothermal coupling effect in
$\beta $
-Ga2O3 metal-oxide–semiconductor field-effect transistors (MOSFETs) are essential to assess the thermal behavior from device to circuit level. In this article, we proposed a physics-based compact electrothermal model of
$\beta $
-Ga2O3 MOSFETs. Analytical solutions of current, terminal charge, and channel temperature are obtained based on surface potential, Ward-Dutton’s charge-partitioning scheme, and Fourier’s heat conduction law, respectively. Moreover, temperature-dependence mobility and device power dissipation are employed to couple electrical and thermal properties by embedding a two-order RC thermal subcircuit. The model is rigidly verified by comparing against experimental data and 3-D-FEM simulations under different process conditions. Especially, the calibrated model is used to evaluate the effect of technology parameters such as substrate material and thickness on boost converter performance, providing design space in design-technology co-optimization (DTCO) flow.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.