选择性激光熔化铜锡合金的结构分析

Ramin Rahmani , Pedro R. Resende , Rúben Couto , Sérgio I. Lopes , Rahul Kumar , Himanshu S. Maurya , Javad Karimi , Alexandre M. Afonso , Abrar Hussain , João C.C. Abrantes
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引用次数: 0

摘要

用铜合金以快速成型方法制造出具有高热能和机械性能的复杂几何形状已引起研究人员的关注。本论文探讨了利用散热器和热交换器应用中的粉末颗粒对铜基合金进行增材制造(AM)。选择性激光熔化(SLM)参数具有低激光束功率(160 W)、中等扫描速度(320 mm/s)和高能量密度(200 J/mm³)的特点,可利用 CuSn10 颗粒制造致密部件。目前的工作涉及微加工的结构分析和精度研究,特别是在支柱、管和鳍方面。研究了支柱结构的机械性能(压缩和硬度)、管状结构的压差评估以及鳍状结构的导热性和导电性分析。结果表明,与纯铜相比,这种材料的强度有所提高,更易于进行 AM 加工。所获得的结果证实了 AM 的可行性,表明使用 SLM 工艺成功地用铜合金制造出了复杂的多孔固态组合结构。本文介绍了铜锡合金的全面结构研究和表征,旨在建立分析铜合金的标准化方法。结果表明,通过 CuSn10 合金制造的小尺寸结构具有 34.3 W-m-¹-K-¹ 的热导率、4.72×10⁶ S/m 的电导率、119 HV-50 的硬度、6 µm 的均匀表面粗糙度,并能承受 1 kN 的力载荷。
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Structural analysis of selective laser melted copper-tin alloy

Additively manufactured complex geometries from copper alloys with high thermal and mechanical properties have drawn the attention of researchers. The present contribution explores the additive manufacturing (AM) of copper-based alloys from powder particles intended for heat sink and heat exchange applications. Selective laser melting (SLM) parameters featuring low laser beam power (160 W), moderate scanning speed (320 mm/s), and high energy density (200 J/mm³) were employed to fabricate dense components from CuSn10 particles. The present work deal with structural analysis and precision investigation of microfabrication, particularly in Struts, Tubes, and Fins. Mechanical properties (compression and hardness) for Strut structure, differential pressure evaluations for Tube structure, and analyses of thermal and electrical conductivities for Fin structure were investigated. The results showed an improvement in strength compared to those of pure copper, facilitating ease of AM. The obtained results affirm the feasibility of AM, demonstrating the successful creation of complex and combined solid-porous structures using SLM process from Cu alloys. A comprehensive structural investigation and characterization of the Cu–Sn alloy is presented here, aiming to establish a standardized approach for analysing Cu alloys. The results indicate that small-scaled structures fabricated via CuSn10 alloy exhibits a thermal conductivity of 34.3 W·m⁻¹·K⁻¹, an electrical conductivity of 4.72×10⁶ S/m, a hardness of 119 HV-50, a uniform surface roughness of 6 µm, and can withstand a force loading of 1 kN.

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