{"title":"利用弹性薄膜剥离柔性板时的界面不稳定性","authors":"","doi":"10.1016/j.jmps.2024.105821","DOIUrl":null,"url":null,"abstract":"<div><p>Adhesive interactions between soft materials are prevalent in both biological systems and various engineering applications, including soft robots, flexible electronics, and antifouling coatings. Many studies have demonstrated that cavitation and fingering instabilities emerge at the adhesive interface between rigid objects and soft films, owing to the geometric attributes of the contact region. However, in the context of peeling configurations, defining the geometric features is challenging, resulting in relatively scant exploration of interfacial instabilities. Hence, the modulation of instability patterns during the peeling process of a flexible plate from a thin elastic film, alongside the consequential effects on mechanical responses, remains poorly understood. To elucidate the mechanisms underlying interfacial instability during peeling process and its impacts on peel-off force, we use finite element methods to simulate the evolution of interface separation. Consistent with previous experimental observations, we find that the interfacial instability will occur when the bending stiffness of the flexible plate is bigger than a critical value. We show that the interfacial instability is mainly induced by the competition between the adhesion energy and the strain energy of the film, and the incompressibility of the thin film is critical for the appearance of the interfacial instability. Combining theory and finite element simulation, we propose the scaling laws for the critical peel-off force for stable and unstable peelings, respectively, and show that the critical peel-off force will decrease when the interfacial instability occurs. Finally, we demonstrate that weakening the tangential adhesion strength and loosening the constraints between the film and the rigid substrate effectively suppress fingering instability. Collectively, our findings elucidate the pivotal factors influencing interfacial instability, offering invaluable insights for the design of structures or systems involving soft materials.</p></div>","PeriodicalId":17331,"journal":{"name":"Journal of The Mechanics and Physics of Solids","volume":null,"pages":null},"PeriodicalIF":5.0000,"publicationDate":"2024-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Exploiting interfacial instability during peeling a flexible plate from elastic films\",\"authors\":\"\",\"doi\":\"10.1016/j.jmps.2024.105821\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Adhesive interactions between soft materials are prevalent in both biological systems and various engineering applications, including soft robots, flexible electronics, and antifouling coatings. Many studies have demonstrated that cavitation and fingering instabilities emerge at the adhesive interface between rigid objects and soft films, owing to the geometric attributes of the contact region. However, in the context of peeling configurations, defining the geometric features is challenging, resulting in relatively scant exploration of interfacial instabilities. Hence, the modulation of instability patterns during the peeling process of a flexible plate from a thin elastic film, alongside the consequential effects on mechanical responses, remains poorly understood. To elucidate the mechanisms underlying interfacial instability during peeling process and its impacts on peel-off force, we use finite element methods to simulate the evolution of interface separation. Consistent with previous experimental observations, we find that the interfacial instability will occur when the bending stiffness of the flexible plate is bigger than a critical value. We show that the interfacial instability is mainly induced by the competition between the adhesion energy and the strain energy of the film, and the incompressibility of the thin film is critical for the appearance of the interfacial instability. Combining theory and finite element simulation, we propose the scaling laws for the critical peel-off force for stable and unstable peelings, respectively, and show that the critical peel-off force will decrease when the interfacial instability occurs. Finally, we demonstrate that weakening the tangential adhesion strength and loosening the constraints between the film and the rigid substrate effectively suppress fingering instability. Collectively, our findings elucidate the pivotal factors influencing interfacial instability, offering invaluable insights for the design of structures or systems involving soft materials.</p></div>\",\"PeriodicalId\":17331,\"journal\":{\"name\":\"Journal of The Mechanics and Physics of Solids\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":5.0000,\"publicationDate\":\"2024-08-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of The Mechanics and Physics of Solids\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0022509624002874\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of The Mechanics and Physics of Solids","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0022509624002874","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Exploiting interfacial instability during peeling a flexible plate from elastic films
Adhesive interactions between soft materials are prevalent in both biological systems and various engineering applications, including soft robots, flexible electronics, and antifouling coatings. Many studies have demonstrated that cavitation and fingering instabilities emerge at the adhesive interface between rigid objects and soft films, owing to the geometric attributes of the contact region. However, in the context of peeling configurations, defining the geometric features is challenging, resulting in relatively scant exploration of interfacial instabilities. Hence, the modulation of instability patterns during the peeling process of a flexible plate from a thin elastic film, alongside the consequential effects on mechanical responses, remains poorly understood. To elucidate the mechanisms underlying interfacial instability during peeling process and its impacts on peel-off force, we use finite element methods to simulate the evolution of interface separation. Consistent with previous experimental observations, we find that the interfacial instability will occur when the bending stiffness of the flexible plate is bigger than a critical value. We show that the interfacial instability is mainly induced by the competition between the adhesion energy and the strain energy of the film, and the incompressibility of the thin film is critical for the appearance of the interfacial instability. Combining theory and finite element simulation, we propose the scaling laws for the critical peel-off force for stable and unstable peelings, respectively, and show that the critical peel-off force will decrease when the interfacial instability occurs. Finally, we demonstrate that weakening the tangential adhesion strength and loosening the constraints between the film and the rigid substrate effectively suppress fingering instability. Collectively, our findings elucidate the pivotal factors influencing interfacial instability, offering invaluable insights for the design of structures or systems involving soft materials.
期刊介绍:
The aim of Journal of The Mechanics and Physics of Solids is to publish research of the highest quality and of lasting significance on the mechanics of solids. The scope is broad, from fundamental concepts in mechanics to the analysis of novel phenomena and applications. Solids are interpreted broadly to include both hard and soft materials as well as natural and synthetic structures. The approach can be theoretical, experimental or computational.This research activity sits within engineering science and the allied areas of applied mathematics, materials science, bio-mechanics, applied physics, and geophysics.
The Journal was founded in 1952 by Rodney Hill, who was its Editor-in-Chief until 1968. The topics of interest to the Journal evolve with developments in the subject but its basic ethos remains the same: to publish research of the highest quality relating to the mechanics of solids. Thus, emphasis is placed on the development of fundamental concepts of mechanics and novel applications of these concepts based on theoretical, experimental or computational approaches, drawing upon the various branches of engineering science and the allied areas within applied mathematics, materials science, structural engineering, applied physics, and geophysics.
The main purpose of the Journal is to foster scientific understanding of the processes of deformation and mechanical failure of all solid materials, both technological and natural, and the connections between these processes and their underlying physical mechanisms. In this sense, the content of the Journal should reflect the current state of the discipline in analysis, experimental observation, and numerical simulation. In the interest of achieving this goal, authors are encouraged to consider the significance of their contributions for the field of mechanics and the implications of their results, in addition to describing the details of their work.