{"title":"从自加热角度加速纳米线场效应晶体管可靠性预测的机器学习方法","authors":"T. Sandeep Kumar , Anusha Hazarika , P.S.T.N. Srinivas , Pramod Kumar Tiwari , Arun Kumar","doi":"10.1016/j.microrel.2024.115484","DOIUrl":null,"url":null,"abstract":"<div><p>Nanowire Field Effect Transistors (NWFETs) have been considered as the next-generation technology for sub-10 nm technology nodes, succeeding FinFETs. However, the highly confined nature of Nanowire FETs creates reliability issues that significantly impact their performance. Therefore, this work proposes a machine learning-based technique for analyzing the self-heating-induced reliability issues in NWFETs. The influence of self-heating effects in NWFET has been predicted in terms of saturation current (I<sub>dsat</sub>), threshold voltage (V<sub>th</sub>), the maximum carrier temperature along the channel (eTmax), and the maximum Lattice temperature (LTmax) with multivariable regression. TCAD-assisted machine learning has been used for algorithm training and prediction. A dataset has been created by varying the parameters of the NWFETs like the thickness of the channel (t<sub>si</sub>), the thickness of oxide (t<sub>ox</sub>), Length of source/drain (L<sub>sd</sub>), length of source/drain contact (L<sub>sdc</sub>), doping concentrations etc. The Random Forest Regression algorithm has been used to estimate the performance of NWFETs in predicting the desired output parameters suitably with the given dataset.</p></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"161 ","pages":"Article 115484"},"PeriodicalIF":1.6000,"publicationDate":"2024-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A machine learning approach to accelerate reliability prediction in nanowire FETs from self-heating perspective\",\"authors\":\"T. Sandeep Kumar , Anusha Hazarika , P.S.T.N. Srinivas , Pramod Kumar Tiwari , Arun Kumar\",\"doi\":\"10.1016/j.microrel.2024.115484\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Nanowire Field Effect Transistors (NWFETs) have been considered as the next-generation technology for sub-10 nm technology nodes, succeeding FinFETs. However, the highly confined nature of Nanowire FETs creates reliability issues that significantly impact their performance. Therefore, this work proposes a machine learning-based technique for analyzing the self-heating-induced reliability issues in NWFETs. The influence of self-heating effects in NWFET has been predicted in terms of saturation current (I<sub>dsat</sub>), threshold voltage (V<sub>th</sub>), the maximum carrier temperature along the channel (eTmax), and the maximum Lattice temperature (LTmax) with multivariable regression. TCAD-assisted machine learning has been used for algorithm training and prediction. A dataset has been created by varying the parameters of the NWFETs like the thickness of the channel (t<sub>si</sub>), the thickness of oxide (t<sub>ox</sub>), Length of source/drain (L<sub>sd</sub>), length of source/drain contact (L<sub>sdc</sub>), doping concentrations etc. The Random Forest Regression algorithm has been used to estimate the performance of NWFETs in predicting the desired output parameters suitably with the given dataset.</p></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":\"161 \",\"pages\":\"Article 115484\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-08-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271424001641\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424001641","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A machine learning approach to accelerate reliability prediction in nanowire FETs from self-heating perspective
Nanowire Field Effect Transistors (NWFETs) have been considered as the next-generation technology for sub-10 nm technology nodes, succeeding FinFETs. However, the highly confined nature of Nanowire FETs creates reliability issues that significantly impact their performance. Therefore, this work proposes a machine learning-based technique for analyzing the self-heating-induced reliability issues in NWFETs. The influence of self-heating effects in NWFET has been predicted in terms of saturation current (Idsat), threshold voltage (Vth), the maximum carrier temperature along the channel (eTmax), and the maximum Lattice temperature (LTmax) with multivariable regression. TCAD-assisted machine learning has been used for algorithm training and prediction. A dataset has been created by varying the parameters of the NWFETs like the thickness of the channel (tsi), the thickness of oxide (tox), Length of source/drain (Lsd), length of source/drain contact (Lsdc), doping concentrations etc. The Random Forest Regression algorithm has been used to estimate the performance of NWFETs in predicting the desired output parameters suitably with the given dataset.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.