Zhan Gao, Chenglong Wang, Yongchao Sun, Mingbo Sun
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引用次数: 0
摘要
高速飞行器在高超音速/超音速来流作用下,壁面温度会迅速升高,从而导致流动结构发生显著变化。为了研究由壁温控制的超音速空腔内流动类型的转变,我们进行了数值模拟。结果表明,当温度达到约 775 K 时,长深比(L/D)为 13 的空腔流动类型会从封闭型空腔流动转变为过渡型空腔流动。此外,空腔流动随壁温变化的机制可能是空腔内再循环区和剪切层之间的竞争。随着壁温升高,再循环区的压力升高,削弱了空腔剪切层的向下发展,使其无法撞击空腔底板。因此,超音速腔内腔唇表面的质量交换、压力分布、总压力恢复系数和传热分布都发生了显著变化。临界壁温也受到侧壁效应和流入马赫数的影响。
Transition of the flow type in the supersonic cavity controlled by the wall temperature
The wall temperature of the high-speed aircraft increases quickly under hypersonic/supersonic incoming flow, which will cause a significant change in the flow structure. To study the transition of the flow type in the supersonic cavity controlled by the wall temperature, numerical simulations are conducted. The cavity length-to-depth ratio (L/D) is varied from 10 to 15, and the wall temperature ranges from 300 K to 1300 K. The results indicate that the type of cavity flow with an L/D ratio of 13 transforms from a closed cavity flow to a transitional cavity flow, when the temperature reaches approximately 775 K. And the transitional temperature rises with the elevated total temperature of the incoming flow. Furthermore, the mechanism of the cavity flow change with wall temperature could be the competition between the recirculation zone and the shear layer in the cavity. The rising pressure with higher wall temperature in the recirculation zone weakens the downward development of the cavity shear layer, preventing it from hitting the cavity floor. As a result, the mass exchange of cavity lip surface, pressure distribution, total pressure recovery coefficient, and heat transfer distribution in the supersonic cavity change dramatically. The critical wall temperature also affected by the sidewall effects and the inflow Mach number.
期刊介绍:
The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows.
Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.