{"title":"新型可回收环氧树脂,具有可释放的残余应力、协同增强的介电性能和愈合能力","authors":"","doi":"10.1016/j.polymer.2024.127569","DOIUrl":null,"url":null,"abstract":"<div><p>It has been a challenge to improve the performance of epoxy insulation in the whole life cycle by achieving the reduction of residual stress during manufacturing, the healing of damages during application, and the recycling after decommissioning. In this paper, a novel recyclable epoxy resin (SEP) with releasable residual stress and synergistically enhanced dielectric properties and healing ability was successfully developed by introducing dynamic thiocarbamate bonds (DTBs). A reduction in residual stresses by 45 % was detected after SEP was annealed at 30 °C below the glassy transition temperature (<em>T</em><sub>g</sub>) for 8 h, during which the mechanical properties remained unchanged. Synergistically improved dielectric properties and damage-healing ability were also observed in SEP. A high healing efficiency of 94.4 % for electrical breakdown damage was found in SEP, meanwhile its dielectric properties were superior to commercial epoxy resin. Additionally, SEP featured good recyclability, including reprocessability and degradability. All those excellent properties were ascribed to the dissociation and recombination of DTBs triggered by thermal stimulation. This work provides an effective solution to a series of issues throughout the full lifecycle of epoxy materials.</p></div>","PeriodicalId":405,"journal":{"name":"Polymer","volume":null,"pages":null},"PeriodicalIF":4.1000,"publicationDate":"2024-08-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel recyclable epoxy resin with releasable residual stress and synergistically enhanced dielectric properties and healing ability\",\"authors\":\"\",\"doi\":\"10.1016/j.polymer.2024.127569\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>It has been a challenge to improve the performance of epoxy insulation in the whole life cycle by achieving the reduction of residual stress during manufacturing, the healing of damages during application, and the recycling after decommissioning. In this paper, a novel recyclable epoxy resin (SEP) with releasable residual stress and synergistically enhanced dielectric properties and healing ability was successfully developed by introducing dynamic thiocarbamate bonds (DTBs). A reduction in residual stresses by 45 % was detected after SEP was annealed at 30 °C below the glassy transition temperature (<em>T</em><sub>g</sub>) for 8 h, during which the mechanical properties remained unchanged. Synergistically improved dielectric properties and damage-healing ability were also observed in SEP. A high healing efficiency of 94.4 % for electrical breakdown damage was found in SEP, meanwhile its dielectric properties were superior to commercial epoxy resin. Additionally, SEP featured good recyclability, including reprocessability and degradability. All those excellent properties were ascribed to the dissociation and recombination of DTBs triggered by thermal stimulation. This work provides an effective solution to a series of issues throughout the full lifecycle of epoxy materials.</p></div>\",\"PeriodicalId\":405,\"journal\":{\"name\":\"Polymer\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2024-08-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polymer\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0032386124009054\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0032386124009054","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
Novel recyclable epoxy resin with releasable residual stress and synergistically enhanced dielectric properties and healing ability
It has been a challenge to improve the performance of epoxy insulation in the whole life cycle by achieving the reduction of residual stress during manufacturing, the healing of damages during application, and the recycling after decommissioning. In this paper, a novel recyclable epoxy resin (SEP) with releasable residual stress and synergistically enhanced dielectric properties and healing ability was successfully developed by introducing dynamic thiocarbamate bonds (DTBs). A reduction in residual stresses by 45 % was detected after SEP was annealed at 30 °C below the glassy transition temperature (Tg) for 8 h, during which the mechanical properties remained unchanged. Synergistically improved dielectric properties and damage-healing ability were also observed in SEP. A high healing efficiency of 94.4 % for electrical breakdown damage was found in SEP, meanwhile its dielectric properties were superior to commercial epoxy resin. Additionally, SEP featured good recyclability, including reprocessability and degradability. All those excellent properties were ascribed to the dissociation and recombination of DTBs triggered by thermal stimulation. This work provides an effective solution to a series of issues throughout the full lifecycle of epoxy materials.
期刊介绍:
Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics.
The main scope is covered but not limited to the following core areas:
Polymer Materials
Nanocomposites and hybrid nanomaterials
Polymer blends, films, fibres, networks and porous materials
Physical Characterization
Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films
Polymer Engineering
Advanced multiscale processing methods
Polymer Synthesis, Modification and Self-assembly
Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization
Technological Applications
Polymers for energy generation and storage
Polymer membranes for separation technology
Polymers for opto- and microelectronics.