基于 28 纳米 9T SRAM 的 CIM 宏,带电容加权模块和冗余阵列辅助 ADC

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Journal Pub Date : 2024-09-03 DOI:10.1016/j.mejo.2024.106397
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引用次数: 0

摘要

在新兴的内存计算(CIM)领域,本研究介绍了一种基于 28 纳米 CMOS 的静态随机存取存储器(SRAM)CIM 宏,它能够进行各种计算模式,有可能为冯-诺依曼瓶颈提供一种解决方案。除了传统的 SRAM 读写操作外,为了提高 CIM 宏的灵活性,还提出了一种用于执行 AND、OR 和 XNOR 操作的 9T 单元;引入了一种新的电容加权模块,以减少传统梯形电容器的面积;并提出了一种冗余阵列辅助模数转换器 (ADC),以提高 ADC 量化过程中的线性度。所提出的架构可实现多位乘法累加 (MAC)、OR 累加 (ORA) 和 XNOR 累加 (XNORA)。该架构采用 28 纳米 CMOS 工艺进行仿真,蒙特卡罗仿真结果表明,在 SS 工艺转角处,BL 电压的标准偏差很小,仅为 16.27 mV。在 TT 工艺转角处,MAC、XNORA 和 ORA 操作的能耗分别为 5.76、5.85 和 5.82 fJ/op。
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A 28-nm 9T SRAM-based CIM macro with capacitance weighting module and redundant array-assisted ADC

In the emerging field of Computing-in-Memory (CIM), this study introduces a 28-nm CMOS-based Static Random Access Memory (SRAM) CIM macro capable of various computational modes, potentially offering a solution to the Von Neumann bottleneck. Beyond traditional SRAM read and write operations, to enhance the flexibility of the CIM macro, a 9T cell is proposed for performing AND, OR, and XNOR operations; a new capacitive weighting module is introduced to reduce the area of conventional ladder capacitors; and a redundant array-assisted Analog-to-Digital Converter (ADC) is proposed to improve linearity during ADC quantization. The proposed architecture can achieve multi-bit multiplication and accumulation (MAC), OR accumulation (ORA), and XNOR accumulation (XNORA). Simulated using a 28-nm CMOS process, the architecture demonstrated a minor standard deviation in BL voltage of 16.27 mV at the SS process corner, as evidenced by Monte Carlo simulation. At the TT process corner, the energy expenditure for MAC, XNORA, and ORA operations was 5.76, 5.85, and 5.82 fJ/op, respectively.

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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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