{"title":"带铜夹层镍钛超声点焊中的微结构演变、力学性能和超弹性行为","authors":"","doi":"10.1016/j.matchar.2024.114336","DOIUrl":null,"url":null,"abstract":"<div><p>The microstructural evolution of NiTi shape memory alloy (SMA) with Cu interlayer joints fabricated by ultrasonic spot welding (USW) was thoroughly investigated using transmission electron microscopy (TEM) and Transmission Kikuchi Diffraction (TKD). Furthermore, an analysis was conducted on how these microstructural changes influence the behavior of superelasticity. Significant plastic deformation and element diffusion occur during the USW process, leading to the formation of dislocation entanglements, Ti(Ni<sub>0.5</sub>Cu<sub>0.5</sub>), Ni<sub>3-<em>x</em></sub>Cu<sub><em>x</em></sub>Ti phases, and NiTiCu<sub>2</sub>O<sub>4</sub> nano-oxide in the vicinity of the interface. According to high-resolution transmission electron microscopy (HRTEM) results, there exists a crystallographic orientation relationship (ORs) between Cu and Ti(Ni<sub>0.5</sub>Cu<sub>0.5</sub>): [011]Cu//[100]Ti(Ni<sub>0.5</sub>Cu<sub>0.5</sub>). Additionally, semi-coherent interfaces form at Cu/Ti(Ni<sub>0.5</sub>Cu<sub>0.5</sub>) and NiTiCu<sub>2</sub>O<sub>4</sub>/R-phase interfaces. However, during cyclic tensile testing, the deterioration of superelastic response in NiTi joints is primarily attributed to the hindrance caused by the USW-induced room-temperature stabilized martensite, dislocation entanglements, and NiTiCu<sub>2</sub>O<sub>4</sub> during martensite reverse transformation.</p></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":null,"pages":null},"PeriodicalIF":4.8000,"publicationDate":"2024-09-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microstructural evolution, mechanical properties and superelasticity behavior in ultrasonic spot welding NiTi with Cu interlayer\",\"authors\":\"\",\"doi\":\"10.1016/j.matchar.2024.114336\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The microstructural evolution of NiTi shape memory alloy (SMA) with Cu interlayer joints fabricated by ultrasonic spot welding (USW) was thoroughly investigated using transmission electron microscopy (TEM) and Transmission Kikuchi Diffraction (TKD). Furthermore, an analysis was conducted on how these microstructural changes influence the behavior of superelasticity. Significant plastic deformation and element diffusion occur during the USW process, leading to the formation of dislocation entanglements, Ti(Ni<sub>0.5</sub>Cu<sub>0.5</sub>), Ni<sub>3-<em>x</em></sub>Cu<sub><em>x</em></sub>Ti phases, and NiTiCu<sub>2</sub>O<sub>4</sub> nano-oxide in the vicinity of the interface. According to high-resolution transmission electron microscopy (HRTEM) results, there exists a crystallographic orientation relationship (ORs) between Cu and Ti(Ni<sub>0.5</sub>Cu<sub>0.5</sub>): [011]Cu//[100]Ti(Ni<sub>0.5</sub>Cu<sub>0.5</sub>). Additionally, semi-coherent interfaces form at Cu/Ti(Ni<sub>0.5</sub>Cu<sub>0.5</sub>) and NiTiCu<sub>2</sub>O<sub>4</sub>/R-phase interfaces. However, during cyclic tensile testing, the deterioration of superelastic response in NiTi joints is primarily attributed to the hindrance caused by the USW-induced room-temperature stabilized martensite, dislocation entanglements, and NiTiCu<sub>2</sub>O<sub>4</sub> during martensite reverse transformation.</p></div>\",\"PeriodicalId\":18727,\"journal\":{\"name\":\"Materials Characterization\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.8000,\"publicationDate\":\"2024-09-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Characterization\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1044580324007174\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580324007174","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
Microstructural evolution, mechanical properties and superelasticity behavior in ultrasonic spot welding NiTi with Cu interlayer
The microstructural evolution of NiTi shape memory alloy (SMA) with Cu interlayer joints fabricated by ultrasonic spot welding (USW) was thoroughly investigated using transmission electron microscopy (TEM) and Transmission Kikuchi Diffraction (TKD). Furthermore, an analysis was conducted on how these microstructural changes influence the behavior of superelasticity. Significant plastic deformation and element diffusion occur during the USW process, leading to the formation of dislocation entanglements, Ti(Ni0.5Cu0.5), Ni3-xCuxTi phases, and NiTiCu2O4 nano-oxide in the vicinity of the interface. According to high-resolution transmission electron microscopy (HRTEM) results, there exists a crystallographic orientation relationship (ORs) between Cu and Ti(Ni0.5Cu0.5): [011]Cu//[100]Ti(Ni0.5Cu0.5). Additionally, semi-coherent interfaces form at Cu/Ti(Ni0.5Cu0.5) and NiTiCu2O4/R-phase interfaces. However, during cyclic tensile testing, the deterioration of superelastic response in NiTi joints is primarily attributed to the hindrance caused by the USW-induced room-temperature stabilized martensite, dislocation entanglements, and NiTiCu2O4 during martensite reverse transformation.
期刊介绍：
Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials.
The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal.
The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include:
Metals & Alloys
Ceramics
Nanomaterials
Biomedical materials
Optical materials
Composites
Natural Materials.
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