利用临时粘合技术制造用于创建硅中间膜的 TSV 结构的技术

IF 0.8 Q3 Engineering Nanotechnologies in Russia Pub Date : 2024-09-10 DOI:10.1134/s2635167624600408

N. A. Djuzhev, E. E. Gusev, M. Yu. Fomichev, P. S. Ivanin

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引用次数: 0

摘要

摘要在俄罗斯，我们首次提出了一种用于在硅片上形成通孔（硅通孔 (TSV) 结构）的临时硅片键合技术，其深度与直径的纵横比很高（超过 10:1），同时还提出了一种将对准标记从薄硅片正面转移到背面的方法，该方法包括使用玻璃载板，使光刻时的组件有足够的偏转量。Si-glass 粘合的现代化操作参数包括控制载板的冷却速度以及在冷却阶段对载板施加压力，从而确保在减薄前将所得组件的偏转量减少 75%，在减薄至 125 μm 的残余厚度后将偏转量减少 65%，同时保持载板的机械完整性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Technology for Manufacturing TSV Structures for the Creation of Silicon Interposers Using Temporary-Bonding Technology

Abstract

For the first time in Russia, we present a technology for temporary wafer bonding, which is used to form through holes in silicon (through-silica via (TSV) structures) with a high aspect ratio of depth to diameter (more than 10 to 1), as well as a method for transferring alignment marks from the front to the back side of a thin Si wafer, consisting in the use of a glass carrier plate, which allows for a sufficient amount of deflection of the assembly for lithography. The modernized operating parameters of Si-glass bonding, which consist in controlling the cooling rate of the plates and applying pressure to the plates during their cooling phase, ensure a reduction in the deflection of the resulting assembly by 75% before thinning and by 65% after thinning to a residual thickness of 125 μm while maintaining the mechanical integrity of the plates.

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来源期刊

Nanotechnologies in Russia NANOSCIENCE & NANOTECHNOLOGY-

CiteScore

1.20

自引率

0.00%

发文量

期刊介绍： Nanobiotechnology Reports publishes interdisciplinary research articles on fundamental aspects of the structure and properties of nanoscale objects and nanomaterials, polymeric and bioorganic molecules, and supramolecular and biohybrid complexes, as well as articles that discuss technologies for their preparation and processing, and practical implementation of products, devices, and nature-like systems based on them. The journal publishes original articles and reviews that meet the highest scientific quality standards in the following areas of science and technology studies: self-organizing structures and nanoassemblies; nanostructures, including nanotubes; functional and structural nanomaterials; polymeric, bioorganic, and hybrid nanomaterials; devices and products based on nanomaterials and nanotechnology; nanobiology and genetics, and omics technologies; nanobiomedicine and nanopharmaceutics; nanoelectronics and neuromorphic computing systems; neurocognitive systems and technologies; nanophotonics; natural science methods in a study of cultural heritage items; metrology, standardization, and monitoring in nanotechnology.