封装在三维和二维半导体与金属板之间的石墨烯的热电功率因数的理论估计值

IF 0.6 4区 物理与天体物理 Q4 PHYSICS, CONDENSED MATTER Semiconductors Pub Date : 2024-09-02 DOI:10.1134/s1063782624020039
S. Yu. Davydov, O. V. Posrednik
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引用次数: 0

摘要

摘要 将封装石墨烯的电导率、塞贝克系数和热电功率因数值视为化学势的函数,对其极端条件进行了界定。三维和二维半导体及过渡金属被视为板坯。通过使用简单的模型,我们获得了分析结果。我们对硅块、Ge 和 16 种二元 III-V 和 II-VI 化合物、六种二维半导体过渡金属二掺杂物以及 3d、4d 和 5d 系列的所有元素进行了数值估算。此外,还推荐了可最大限度提高热电特性的板坯材料。此外,还简要讨论了封装两层石墨烯。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Theoretical Estimates of the Thermoelectric Power Factor of Graphene Encapsulated between 3D and 2D Semiconductor and Metal Slabs

Abstract

The conditions of extremeness of the conductivity, the Seebeck coefficient and the thermoelectric power factor values of encapsulated graphene, considered as a functions of the chemical potential, are de-termined. 3D and 2D semiconductors and transition metals are considered as slabs. The use of simple models allowed us to obtain analytical results. Numerical estimates were performed for bulk Si, Ge and 16 binary III‒V and II–VI compounds, six two-dimensional semiconductor transition metal dichalcagenides and all elements of the 3d-, 4d-, and 5d-series. Recommendations of slab materials allowing to maximize thermoelectric characteristics are given. Encapsulated two-layer graphene is also briefly discussed.

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来源期刊
Semiconductors
Semiconductors 物理-物理:凝聚态物理
CiteScore
1.50
自引率
28.60%
发文量
131
审稿时长
3-6 weeks
期刊介绍: Publishes the most important work in semiconductor research in the countries of the former Soviet Union. Covers semiconductor theory, transport phenomena in semiconductors, optics, magnetooptics, and electrooptics of semiconductors, semiconductor lasers and semiconductor surface physics. The journal features an extensive book review section.
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