使用可切换双模混合谐振器的高选择性带通滤波器集成 SPDT 开关

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-12 DOI:10.1109/TCPMT.2024.3459639
Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che
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引用次数: 0

摘要

本文提出了一种基于可切换双模混合谐振器的高选择性带通滤波器集成单刀双掷(SPDT)开关。为了解决高导通损耗和高关断抑制(OSS)之间的内在矛盾,本文提出了一种由 16 模 SIW、微带存根和 PIN 二极管构成的具有两种谐振模式的可切换双模混合谐振器。加载在 16 模 SIW 开口端的 PIN 二极管用于切换谐振状态。为了增强导通和关断通道之间的隔离,使用了一条公共耦合馈电线来提供两个相同的耦合路径,从而减轻了关断状态通道的阻抗影响。此外,通过调整拟议谐振器的结构参数,开关的传输零点(TZ)可以独立控制。在理论分析方面,研究了 SPDT 开关的等效电路模型。根据等效电路,计算出了 TZ 的频率。为了进行实验验证,设计、制造并测量了中心频率为 $f_{0} =4.9$ GHz、纹波带宽为 400 MHz 的二阶 BPF 集成 SPDT 开关。实现了仅为 1.18 dB 的低插入损耗、高上止带抑制和多个传输零点。
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High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators
This article proposes a high-selectivity bandpass filter-integrated single-pole double-throw (SPDT) switch based on switchable dual-mode hybrid resonators. To solve the intrinsic conflict between the high ON-state loss and high OFF-state suppression (OSS), a switchable dual-mode hybrid resonator with two resonant modes constructed by 16-mode SIW, microstrip stub, and PIN diode is proposed. The PIN diode loaded on the open end of the 16-mode SIW is used to switch the resonant state. To enhance the isolation between the ON and OFF channels, a common coupled feed line is used to provide two identical coupling paths, mitigating the impedance impact from the OFF-state channel. In addition, by adjusting the structural parameters of the proposed resonator, the transmission zeros (TZs) of the switch can be controlled independently. For theoretical analysis, the equivalent circuit modeling for the SPDT switch is investigated. Based on the equivalent circuit, the frequencies of TZs are calculated. For experimental verification, the second-order BPF-integrated SPDT switch at center frequency $f_{0} =4.9$ GHz with ripple bandwidth 400 MHz is designed, fabricated, and measured. Low insertion loss of only 1.18 dB, high upper stopband suppression, and multiple transmission zeroes are realized.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
期刊最新文献
Table of Contents Front Cover Table of Contents Front Cover IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
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