{"title":"锡银无铅焊料合金中的小角中子散射分析:聚焦 Ag3Sn 金属间相","authors":"","doi":"10.1016/j.matchar.2024.114385","DOIUrl":null,"url":null,"abstract":"<div><p>This study addresses the critical need for lead-free solder alternatives in electronic manufacturing by investigating the microstructural characteristics of Sn-Ag solder alloys, focusing on the Ag<sub>3</sub>Sn intermetallic phase. Utilizing Small-Angle Neutron Scattering (SANS), the study explored the phase interface and grain structure within Sn-Ag alloy to identify attributes that influence mechanical stability and performance. The research was structured around a comprehensive SANS analysis, complemented by Electron Backscatter Diffraction (EBSD) to expose the morphology and orientation of crystalline phases within the material. The investigation revealed distinct scattering patterns indicative of a multi-phase structure with a homogeneous distribution of fine Ag<sub>3</sub>Sn precipitates within a β-Sn matrix. EBSD data confirmed these findings, showing a wide range of grain sizes and a random orientation distribution that matches theoretical models for polycrystalline materials. Notably, the SANS data uncovered a specific size distribution of the Ag<sub>3</sub>Sn phase, which was characterized by a sharp interface contrast against the β-Sn matrix, pivotal for understanding the solder's mechanical properties. Interpretation of the SANS and EBSD data sets suggests that the Sn-Ag alloy's performance is significantly influenced by the dispersion and morphology of the Ag<sub>3</sub>Sn phase. The presence of nanoscale Ag<sub>3</sub>Sn structures, exhibiting a needle-like surface, implies a material optimized for mechanical reinforcement, which is essential for robust electronic connections. The integrated approach offers a novel perspective on the nano structural arrangement of lead-free solders, contributing to the advancement of safer, more reliable electronic materials. The findings have significant implications for the development of next-generation electronic components, reinforcing the transition to environmentally benign manufacturing processes.</p></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":null,"pages":null},"PeriodicalIF":4.8000,"publicationDate":"2024-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S1044580324007666/pdfft?md5=66c195e2aaa11a3a991f82bfc8d70e63&pid=1-s2.0-S1044580324007666-main.pdf","citationCount":"0","resultStr":"{\"title\":\"Small-angle neutron scattering analysis in Sn-Ag Lead-free solder alloys: A focus on the Ag3Sn intermetallic phase\",\"authors\":\"\",\"doi\":\"10.1016/j.matchar.2024.114385\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This study addresses the critical need for lead-free solder alternatives in electronic manufacturing by investigating the microstructural characteristics of Sn-Ag solder alloys, focusing on the Ag<sub>3</sub>Sn intermetallic phase. Utilizing Small-Angle Neutron Scattering (SANS), the study explored the phase interface and grain structure within Sn-Ag alloy to identify attributes that influence mechanical stability and performance. The research was structured around a comprehensive SANS analysis, complemented by Electron Backscatter Diffraction (EBSD) to expose the morphology and orientation of crystalline phases within the material. The investigation revealed distinct scattering patterns indicative of a multi-phase structure with a homogeneous distribution of fine Ag<sub>3</sub>Sn precipitates within a β-Sn matrix. EBSD data confirmed these findings, showing a wide range of grain sizes and a random orientation distribution that matches theoretical models for polycrystalline materials. Notably, the SANS data uncovered a specific size distribution of the Ag<sub>3</sub>Sn phase, which was characterized by a sharp interface contrast against the β-Sn matrix, pivotal for understanding the solder's mechanical properties. Interpretation of the SANS and EBSD data sets suggests that the Sn-Ag alloy's performance is significantly influenced by the dispersion and morphology of the Ag<sub>3</sub>Sn phase. The presence of nanoscale Ag<sub>3</sub>Sn structures, exhibiting a needle-like surface, implies a material optimized for mechanical reinforcement, which is essential for robust electronic connections. The integrated approach offers a novel perspective on the nano structural arrangement of lead-free solders, contributing to the advancement of safer, more reliable electronic materials. The findings have significant implications for the development of next-generation electronic components, reinforcing the transition to environmentally benign manufacturing processes.</p></div>\",\"PeriodicalId\":18727,\"journal\":{\"name\":\"Materials Characterization\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.8000,\"publicationDate\":\"2024-09-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S1044580324007666/pdfft?md5=66c195e2aaa11a3a991f82bfc8d70e63&pid=1-s2.0-S1044580324007666-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Characterization\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1044580324007666\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580324007666","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
Small-angle neutron scattering analysis in Sn-Ag Lead-free solder alloys: A focus on the Ag3Sn intermetallic phase
This study addresses the critical need for lead-free solder alternatives in electronic manufacturing by investigating the microstructural characteristics of Sn-Ag solder alloys, focusing on the Ag3Sn intermetallic phase. Utilizing Small-Angle Neutron Scattering (SANS), the study explored the phase interface and grain structure within Sn-Ag alloy to identify attributes that influence mechanical stability and performance. The research was structured around a comprehensive SANS analysis, complemented by Electron Backscatter Diffraction (EBSD) to expose the morphology and orientation of crystalline phases within the material. The investigation revealed distinct scattering patterns indicative of a multi-phase structure with a homogeneous distribution of fine Ag3Sn precipitates within a β-Sn matrix. EBSD data confirmed these findings, showing a wide range of grain sizes and a random orientation distribution that matches theoretical models for polycrystalline materials. Notably, the SANS data uncovered a specific size distribution of the Ag3Sn phase, which was characterized by a sharp interface contrast against the β-Sn matrix, pivotal for understanding the solder's mechanical properties. Interpretation of the SANS and EBSD data sets suggests that the Sn-Ag alloy's performance is significantly influenced by the dispersion and morphology of the Ag3Sn phase. The presence of nanoscale Ag3Sn structures, exhibiting a needle-like surface, implies a material optimized for mechanical reinforcement, which is essential for robust electronic connections. The integrated approach offers a novel perspective on the nano structural arrangement of lead-free solders, contributing to the advancement of safer, more reliable electronic materials. The findings have significant implications for the development of next-generation electronic components, reinforcing the transition to environmentally benign manufacturing processes.
期刊介绍:
Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials.
The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal.
The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include:
Metals & Alloys
Ceramics
Nanomaterials
Biomedical materials
Optical materials
Composites
Natural Materials.