Wesley Spain;John Papapolymerou;Prem Chahal;Matthew Hodek;John D. Albrecht
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引用次数: 0
摘要
印刷毫米波（mmW）电子器件在通信领域受到高度关注已有一段时间，因为它具有制造毫米波系统的潜在能力，可利用三维异质集成（3DHI）提高性能，超越传统系统。本文介绍了一种通过气溶胶喷射打印（AJP）制造可转移毫米波结构的方法。开发了一种聚二甲基硅氧烷（PDMS）印章辅助升空程序，用于将打印部件从刚性打印支撑表面分离，并将其应用于粘合目标表面。演示了几种微带 (MS) 线路结构，以确定印章转移对印刷电路射频性能的影响。考虑了射频探针焊盘上印刷孔的影响以及转移后 Beatty 标准线路谐振频率的偏移，并使用 S 参数测量进行了表征。
Printed millimeter-wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-D heterogeneous integration (3DHI) to improve performance beyond traditional systems. In this article, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A polydimethylsiloxane (PDMS) stamp-assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.
期刊介绍：
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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