短脉冲 HiPIMS 放电中电子温度和密度的动态变化

IF 3.8 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2024-09-20 DOI:10.1016/j.vacuum.2024.113672
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引用次数: 0

摘要

这项工作研究了短脉冲高功率脉冲磁控溅射(HiPIMS)放电中电子密度和温度的变化。实验中使用了一个直径为 100 毫米的铜靶平面磁控管。等离子体测量使用的是距离靶85毫米的朗缪尔探针。放电电流脉冲持续时间分别为 8、15 和 100 μs,固定振幅为 100 A,平均放电功率为 1 kW。为了将平均放电功率保持在恒定水平,在缩短脉冲持续时间的同时增加了频率。放电电流脉冲开始时,电子温度超过 10 eV,然后降至几 eV。短脉冲 HiPIMS 中等离子体存在的主要时间是余辉阶段,在此期间电子密度达到最大值 1.9-3.2 × 1012 cm-3,电子温度低于 1 eV。由于短脉冲 HiPIMS 的余辉阶段持续时间长于放电电流脉冲持续时间,因此平均积分电子温度低于直流和中频磁控溅射。HiPIMS 的平均积分电子温度随脉冲持续时间的缩短而降低。
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The dynamics of the electron temperature and density in short-pulse HiPIMS discharge
This work studies the change in electron density and temperature in short-pulse high power impulse magnetron sputtering (HiPIMS) discharge. A planar magnetron with a copper target of 100 mm in diameter was used in the experiments. Plasma measurements were made using a Langmuir probe placed 85 mm from the target. The discharge current pulse durations were 8, 15, and 100 μs, with a fixed amplitude of 100 A and an average discharge power of 1 kW. To maintain the average discharge power at a constant level, a decrease in the pulse duration was accompanied by an increase in the frequency. When the discharge current pulses started, the electron temperature exceeded 10 eV and then decreased to a few eV. The main time of plasma existence in short-pulse HiPIMS is the afterglow phase, during which the electron density reaches a maximum of 1.9–3.2 × 1012 cm−3 and the electron temperature is less than 1 eV. Because the duration of the afterglow phase in short-pulse HiPIMS is longer than the duration of the discharge current pulse, the average integral electron temperature is lower than that in DC and middle-frequency magnetron sputtering. The average integral electron temperature in HiPIMS decreases with decreasing pulse duration.
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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