利用由纳米颗粒组成的轨道在微系统中集成表面贴装器件

IF 2.2 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Sensors Letters Pub Date : 2024-09-13 DOI:10.1109/LSENS.2024.3460969
Tina Mitteramskogler;Andreas Fuchsluger;Rafael Ecker;Sebastian Lang;Thomas Wilfinger;Robert Wille;Bernhard Jakoby
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引用次数: 0

摘要

半导体工业成功地提供了一种大批量、高精度的传感器芯片制造方法,使传感器在日常消费品中无处不在。通常情况下,这些传感器被封装在传感器封装中,并进一步集成到印刷电路板上,因为要与外部世界连接,必须跨越多个长度尺度。在这项工作中,我们展示了如何通过使用开放式微通道将表面贴装器件(SMD)直接集成到聚(甲基丙烯酸甲酯)(PMMA)芯片上。为此,我们将 SMD 直接放置在结构化 PMMA 板上,并通过开放式微通道将其与专用储液器相连。将导电油墨引入这些储液器时,毛细力会将液体引向 SMD,确保储液器与 SMD 之间的电气连接。由于增加了交叉和蜿蜒的导电线,该工艺可用于直接在 PMMA 基底面上用单个 SMD 元件制造电气网络。
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Integration of Surface-Mount Devices in Microsystems Using Tracks Consisting of Nanoparticles
The success of semiconductor industry, providing a high- volume, high-accuracy fabrication method of sensor chips, has caused sensors to be omnipresent in everyday consumer products. Typically, these sensors are enclosed into sensor packages and further integrated onto printed circuit boards since, for the connection to the outer world, several length scales have to be bridged. In this work, we show how surface-mount devices (SMDs) can be directly integrated onto poly(methyl methacrylate) (PMMA) chips through the use of open microchannels. To this end, the SMDs are directly placed onto structured PMMA plates with open microchannels connecting them to dedicated liquid reservoirs. When introducing conductive inks to those reservoirs, capillary forces draw the liquid toward the SMDs and ensure the electrical connection between the liquid reservoir and the SMDs themselves. With the addition of crossings and meandering conductive lines, this process can be used for the fabrication of electrical networks out of individual SMD components directly on a PMMA substrate.
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来源期刊
IEEE Sensors Letters
IEEE Sensors Letters Engineering-Electrical and Electronic Engineering
CiteScore
3.50
自引率
7.10%
发文量
194
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