Agustin J. Lapi;Miguel Sofo-Haro;Benjamin C. Parpillon;Adi Birman;Guillermo Fernandez-Moroni;Lorenzo Rota;Fabricio Alcalde Bessia;Aseem Gupta;Claudio R. Chavez Blanco;Fernando Chierchie;Julie Segal;Christopher J. Kenney;Angelo Dragone;Shaorui Li;Davide Braga;Amos Fenigstein;Juan Estrada;Farah Fahim
{"title":"Skipper-in-CMOS:为像素检测器提供具有亚电子噪声性能的无损读出功能","authors":"Agustin J. Lapi;Miguel Sofo-Haro;Benjamin C. Parpillon;Adi Birman;Guillermo Fernandez-Moroni;Lorenzo Rota;Fabricio Alcalde Bessia;Aseem Gupta;Claudio R. Chavez Blanco;Fernando Chierchie;Julie Segal;Christopher J. Kenney;Angelo Dragone;Shaorui Li;Davide Braga;Amos Fenigstein;Juan Estrada;Farah Fahim","doi":"10.1109/TED.2024.3463631","DOIUrl":null,"url":null,"abstract":"The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a \n<inline-formula> <tex-math>${15} \\times {15}~\\mu $ </tex-math></inline-formula>\nm2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of \n<inline-formula> <tex-math>$0.15\\text {e}^ - $ </tex-math></inline-formula>\n, demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"71 11","pages":"6843-6849"},"PeriodicalIF":2.9000,"publicationDate":"2024-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors\",\"authors\":\"Agustin J. Lapi;Miguel Sofo-Haro;Benjamin C. Parpillon;Adi Birman;Guillermo Fernandez-Moroni;Lorenzo Rota;Fabricio Alcalde Bessia;Aseem Gupta;Claudio R. Chavez Blanco;Fernando Chierchie;Julie Segal;Christopher J. Kenney;Angelo Dragone;Shaorui Li;Davide Braga;Amos Fenigstein;Juan Estrada;Farah Fahim\",\"doi\":\"10.1109/TED.2024.3463631\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a \\n<inline-formula> <tex-math>${15} \\\\times {15}~\\\\mu $ </tex-math></inline-formula>\\nm2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of \\n<inline-formula> <tex-math>$0.15\\\\text {e}^ - $ </tex-math></inline-formula>\\n, demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":\"71 11\",\"pages\":\"6843-6849\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10702470/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10702470/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors
The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a
${15} \times {15}~\mu $
m2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of
$0.15\text {e}^ - $
, demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.