Changxi Liu , Lai-Chang Zhang , Kuaishe Wang , Liqiang Wang
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引用次数: 0
摘要
难熔高熵合金(RHEAs)作为一类新型多主元素合金,因其优异的性能而备受关注。然而,它们的低塑性限制了其潜在的应用领域,而合金元素的高熔点又给增材制造(AM)带来了挑战。在此,我们利用 AM 成功制造出了晶粒内具有广泛分布的蜂窝结构的 RHEA。此外,我们还提出了一种简单的策略,即通过弹性阶段的循环变形处理(微塑性变形),提前在蜂窝结构区域内形成完整的位错网络。位错网络与其他位错纠缠在一起,在邻近细胞壁的地方形成了许多钉点,从而阻碍了位错运动。因此,RHEA 的循环变形加工可达到 1136 兆帕的屈服强度,同时保持 50%的变形应变而不发生断裂。循环变形加工方法为强化添加剂制造的合金提供了一条途径,为克服强度和塑性之间的权衡提供了一种解决方案。
Improving strength and plasticity via pre-assembled dislocation networks in additively manufactured refractory high entropy alloy
Refractory high entropy alloys (RHEAs), as a novel class of multi-principal element alloys, have attracted significant attention owing to their excellent properties. However, their low plasticity limits their potential applications, while the high melting points of the alloying elements face challenges to additive manufacturing (AM). Herein, RHEA, with extensively distributed cellular structure within their grains, was successfully fabricated using AM. Furthermore, we proposed a simple strategy to form a complete dislocation network within the cellular structure region in advance through cyclic deformation processing in the elastic stage (microplastic deformation). Dislocation networks are entangled with other dislocations, creating numerous pinned points adjacent cell walls, which impede dislocation motion. As a result, the cyclic deformation processing of RHEA achieves a yield strength of 1136 MPa while maintaining 50 % deformation strain without fracturing. The cyclic deformation processing method provides a route to strengthen additively manufactured alloys, offering a solution to overcome the trade-off between strength and plasticity.
期刊介绍:
Acta Materialia serves as a platform for publishing full-length, original papers and commissioned overviews that contribute to a profound understanding of the correlation between the processing, structure, and properties of inorganic materials. The journal seeks papers with high impact potential or those that significantly propel the field forward. The scope includes the atomic and molecular arrangements, chemical and electronic structures, and microstructure of materials, focusing on their mechanical or functional behavior across all length scales, including nanostructures.