Methods for performance optimization of ultra-thin heat pipes with composited wick

Ultra-thin heat pipes are extensively utilized in heat dissipation systems for portable electronic devices, and their thermal performance is mainly affected by the wick. A mathematical model of the ultra-thin heat pipe with composited wick of the copper mesh and copper fiber bundle was developed. Based on the mathematical model, the composited wick was optimized to enhance the maximum heat transfer capacity. The optimization results indicated that the heat pipe achieved optimal heat transfer performance with a single layer of copper mesh, a 0.75 mm width copper fiber bundle, and zero position. The optimized wick structure enhanced the maximum heat transfer capacity of the heat pipe by 40.03 % compared to its capacity before optimization.