半导体的高通量热物理特性分析

IF 5.6 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Instrumentation and Measurement Pub Date : 2024-10-25 DOI:10.1109/TIM.2024.3485440
Shaojie Zhou;Yali Mao;Yunliang Ma;Guoliang Ma;Chao Yuan
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引用次数: 0

摘要

泵浦探针热反射(Pump-probe TR)是一种非接触式检测技术,已广泛应用于材料的热特性分析。在传统的表征过程中,通常采用光斑检测,利用非线性拟合过程来拟合未知的热特性参数。然而,在处理样品指定区域内的大量数据时,传统的测量过程显得费时费力。在这项工作中,我们提出了一种用于半导体热物理特性分析的高通量方法。测量系统的光路与自动控制组件相结合,实现了自动扫描测量。深度学习技术被用于高通量数据处理。我们首先用金蓝宝石样品演示了整个测量过程,该样品的夹层是通过涂覆不同的夹层有意控制的。扫描区域内金蓝宝石热边界电导率(TBC)和蓝宝石热导率(TC)的测量结果证明了该方法的有效性。然后,我们展示了无损扫描测量在硅基氮化镓样品工业生产中的应用,并比较了不同分辨率下的测量结果。我们对扫描结果进行了验证,证明这种方法可以进行高精度、高速度的测量。同时,高分辨率扫描测量可以观察到该区域热特性的细微差别。与传统方法相比,这种方法大大减少了测量所需的时间和人力,尤其适用于大批量晶片的热物理特性检测。
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High-Throughput Thermophysical Characterization of Semiconductors
Pump–probe thermoreflectance (Pump–probe TR) is a noncontact detection technique that has been widely used for thermal characterization of materials. In the traditional characterization process, spot detection is usually employed to fit unknown thermal property parameters using a nonlinear fitting process. However, when processing a large amount of data in a specified area of a sample, the traditional measurement process appears to be time-consuming and labor-intensive. In this work, we propose a high-throughput method for semiconductor thermophysical characterization. The optical path of the measurement system is combined with automatic control components to realize automatic scanning measurements. Deep learning techniques are utilized for high-throughput data processing. We first demonstrated the entire measuring process with a Au–sapphire sample, whose interlayers are intentionally controlled by coating different interlayers. The validity of the method can be demonstrated by the measurement results of the thermal boundary conductance (TBC) of Au–sapphire and the thermal conductivity (TC) of sapphire in the scanned area. Then, we demonstrated the application of nondestructive scanning measurement in the industrial production of GaN-on-Si samples, comparing the measurement results at different resolutions. We validate the scanning results demonstrating that this method can measure with high accuracy and speed. Meanwhile, the high-resolution scanning measurement can observe the subtle difference in thermal characterization in the area. This method significantly reduces the time and labor required to measure compared to traditional methods and it is particularly efficient for thermophysical characterization detection of high-volume wafers.
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来源期刊
IEEE Transactions on Instrumentation and Measurement
IEEE Transactions on Instrumentation and Measurement 工程技术-工程:电子与电气
CiteScore
9.00
自引率
23.20%
发文量
1294
审稿时长
3.9 months
期刊介绍: Papers are sought that address innovative solutions to the development and use of electrical and electronic instruments and equipment to measure, monitor and/or record physical phenomena for the purpose of advancing measurement science, methods, functionality and applications. The scope of these papers may encompass: (1) theory, methodology, and practice of measurement; (2) design, development and evaluation of instrumentation and measurement systems and components used in generating, acquiring, conditioning and processing signals; (3) analysis, representation, display, and preservation of the information obtained from a set of measurements; and (4) scientific and technical support to establishment and maintenance of technical standards in the field of Instrumentation and Measurement.
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