Yangwen Mao , Wenbo Wang , Wanyu Huang , Haopeng Cai
{"title":"使用含 P/N/B 的反应型阻燃剂的阻燃、透明、低介电常数和低烟密度 EP 复合材料","authors":"Yangwen Mao , Wenbo Wang , Wanyu Huang , Haopeng Cai","doi":"10.1016/j.polymdegradstab.2024.111078","DOIUrl":null,"url":null,"abstract":"<div><div>For the purpose of investigating the modified flame-retardant epoxy resin (FREP) with the low smoke density release during combustion, the flame retardant containing P/N/B elements named DBT was synthesized with the raw materials of 4-Acetylphenylboronic acid, 3,5-diaminotriazole and DOPO. The DBT was added as a co-curing agent to an amine-cured epoxy resin system, and based on the DSC results of the resin, it was revealed that -NH- in the structure of the DBT was capable of facilitating EP curing. With the introduction of DBT, the transparency of FREP samples was slightly affected. On account of the excellent flame retardancy exerted by the DBT in the FREP system, the FREP samples reached the V-0 grade in UL-94 testing with an LOI of 35.9% at 5 wt% DBT addition. Meanwhile, the results of the cone calorimetry test demonstrated that in comparison with the epoxy resin, the PHRR, THR and av-EHC of the EP/DBT7.5 sample decreased by 34.0%, 35.4% and 18.68%, respectively. The DBT was effective in reducing the smoke density of EP, and the EP/DBT7.5 sample attained the HL1 level for D<sub>S</sub> (4) and VOF<sub>4</sub>. The chemical analyses for residual char revealed that DBT was mainly employed for flame retardancy and smoke suppression by forming P/B-containing chars in the condensed phase. There was no loss of mechanical properties of the FREP samples as the rigid groups were present in the DBT structure. Furthermore, it was noted that the FREP samples exhibited a decrease in dielectric loss and dielectric constant as the content increased.</div></div>","PeriodicalId":406,"journal":{"name":"Polymer Degradation and Stability","volume":"230 ","pages":"Article 111078"},"PeriodicalIF":6.3000,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Flame retardant, transparent, low dielectric and low smoke density EP composites implemented with reactive flame retardants containing P/N/B\",\"authors\":\"Yangwen Mao , Wenbo Wang , Wanyu Huang , Haopeng Cai\",\"doi\":\"10.1016/j.polymdegradstab.2024.111078\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>For the purpose of investigating the modified flame-retardant epoxy resin (FREP) with the low smoke density release during combustion, the flame retardant containing P/N/B elements named DBT was synthesized with the raw materials of 4-Acetylphenylboronic acid, 3,5-diaminotriazole and DOPO. The DBT was added as a co-curing agent to an amine-cured epoxy resin system, and based on the DSC results of the resin, it was revealed that -NH- in the structure of the DBT was capable of facilitating EP curing. With the introduction of DBT, the transparency of FREP samples was slightly affected. On account of the excellent flame retardancy exerted by the DBT in the FREP system, the FREP samples reached the V-0 grade in UL-94 testing with an LOI of 35.9% at 5 wt% DBT addition. Meanwhile, the results of the cone calorimetry test demonstrated that in comparison with the epoxy resin, the PHRR, THR and av-EHC of the EP/DBT7.5 sample decreased by 34.0%, 35.4% and 18.68%, respectively. The DBT was effective in reducing the smoke density of EP, and the EP/DBT7.5 sample attained the HL1 level for D<sub>S</sub> (4) and VOF<sub>4</sub>. The chemical analyses for residual char revealed that DBT was mainly employed for flame retardancy and smoke suppression by forming P/B-containing chars in the condensed phase. There was no loss of mechanical properties of the FREP samples as the rigid groups were present in the DBT structure. Furthermore, it was noted that the FREP samples exhibited a decrease in dielectric loss and dielectric constant as the content increased.</div></div>\",\"PeriodicalId\":406,\"journal\":{\"name\":\"Polymer Degradation and Stability\",\"volume\":\"230 \",\"pages\":\"Article 111078\"},\"PeriodicalIF\":6.3000,\"publicationDate\":\"2024-11-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polymer Degradation and Stability\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S014139102400421X\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer Degradation and Stability","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S014139102400421X","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
Flame retardant, transparent, low dielectric and low smoke density EP composites implemented with reactive flame retardants containing P/N/B
For the purpose of investigating the modified flame-retardant epoxy resin (FREP) with the low smoke density release during combustion, the flame retardant containing P/N/B elements named DBT was synthesized with the raw materials of 4-Acetylphenylboronic acid, 3,5-diaminotriazole and DOPO. The DBT was added as a co-curing agent to an amine-cured epoxy resin system, and based on the DSC results of the resin, it was revealed that -NH- in the structure of the DBT was capable of facilitating EP curing. With the introduction of DBT, the transparency of FREP samples was slightly affected. On account of the excellent flame retardancy exerted by the DBT in the FREP system, the FREP samples reached the V-0 grade in UL-94 testing with an LOI of 35.9% at 5 wt% DBT addition. Meanwhile, the results of the cone calorimetry test demonstrated that in comparison with the epoxy resin, the PHRR, THR and av-EHC of the EP/DBT7.5 sample decreased by 34.0%, 35.4% and 18.68%, respectively. The DBT was effective in reducing the smoke density of EP, and the EP/DBT7.5 sample attained the HL1 level for DS (4) and VOF4. The chemical analyses for residual char revealed that DBT was mainly employed for flame retardancy and smoke suppression by forming P/B-containing chars in the condensed phase. There was no loss of mechanical properties of the FREP samples as the rigid groups were present in the DBT structure. Furthermore, it was noted that the FREP samples exhibited a decrease in dielectric loss and dielectric constant as the content increased.
期刊介绍:
Polymer Degradation and Stability deals with the degradation reactions and their control which are a major preoccupation of practitioners of the many and diverse aspects of modern polymer technology.
Deteriorative reactions occur during processing, when polymers are subjected to heat, oxygen and mechanical stress, and during the useful life of the materials when oxygen and sunlight are the most important degradative agencies. In more specialised applications, degradation may be induced by high energy radiation, ozone, atmospheric pollutants, mechanical stress, biological action, hydrolysis and many other influences. The mechanisms of these reactions and stabilisation processes must be understood if the technology and application of polymers are to continue to advance. The reporting of investigations of this kind is therefore a major function of this journal.
However there are also new developments in polymer technology in which degradation processes find positive applications. For example, photodegradable plastics are now available, the recycling of polymeric products will become increasingly important, degradation and combustion studies are involved in the definition of the fire hazards which are associated with polymeric materials and the microelectronics industry is vitally dependent upon polymer degradation in the manufacture of its circuitry. Polymer properties may also be improved by processes like curing and grafting, the chemistry of which can be closely related to that which causes physical deterioration in other circumstances.