Jonathan Kong , Jonathan L. McCrea , Jane Y. Howe , Uwe Erb
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引用次数: 0
摘要
研究了温度高达 538 °C (1000 °F)的退火对两种电沉积块状纳米钴磷合金(L-nCoP,0.14 at%P 和 H-nCoP,2.17 at%P)的硬度和延展性的影响。通过结合电子显微镜和 X 射线/同步辐射衍射表征、硬度和弯曲延展性测量以及密度泛函理论计算,结果表明硬度受四种加成作用的控制。在 0.14 at%P 时,晶粒尺寸强化和可能的晶界松弛是主要的强化机制。在 2.17 at%P 的合金中,溶质强化和磷化钴前驱体及沉淀物的作用更为显著,并出现了典型的时效强化行为,硬度峰值温度为 371 °C(700 °F)。0.14 at%P 时的弯曲延展性在 12-17% 之间,最高温度可达 482 °C (900 °F)。相反,由于磷化钴前驱体和沉淀物形成过多,2.17 at%P 时的延展性随着退火温度的升高而迅速降低,在 427 °C (800 °F) 时接近 1 %。两种合金的主要变形机制都是基底位错滑移。
Relative hardening contributions and ductility of as-prepared and annealed nanocrystalline Co-P electrodeposits
The effect of annealing up to 538 °C (1000 °F) on the hardness and ductility of two electrodeposited bulk nanocrystalline cobalt-phosphorus alloys (L-nCoP, 0.14 at%P and H-nCoP, 2.17 at%P) was investigated. Through a combination of electron microscopy and X-ray/synchrotron diffraction characterization, hardness and bend ductility measurements as well as density functional theory calculations, it is shown that hardness is controlled by four additive contributions. At 0.14 at%P, grain size strengthening and likely grain boundary relaxation are the dominant strengthening mechanisms. In the 2.17 at%P alloy, the contributions from solute strengthening and cobalt phosphide precursors and precipitates are much more significant and typical age strengthening behavior is observed with a peak hardness temperature of 371 °C (700 °F). The bend ductility at 0.14 at%P was in the 12–17 % range up to 482 °C (900 °F). In contrast, the ductility at 2.17 at%P decreased rapidly with increasing annealing temperatures approaching values less than 1 % at 427 °C (800 °F) due to excessive cobalt phosphide precursor and precipitate formation. The dominant deformation mechanism in both alloys was found to be basal dislocation slip.
期刊介绍:
Materials Science and Engineering A provides an international medium for the publication of theoretical and experimental studies related to the load-bearing capacity of materials as influenced by their basic properties, processing history, microstructure and operating environment. Appropriate submissions to Materials Science and Engineering A should include scientific and/or engineering factors which affect the microstructure - strength relationships of materials and report the changes to mechanical behavior.