Ali Heydari , Ahmad R. Gharaibeh , Mohammad Tradat , Qusai Soud , Yaman Manaserh , Vahideh Radmard , Bahareh Eslami , Jeremy Rodriguez , Bahgat Sammakia
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However, challenges remain, such as ensuring system stability under varying thermal loads and optimizing integration with existing infrastructure. This comprehensive study digs into the area of data center liquid cooling, providing a novel, comprehensive experimental investigation of the critical steps and tests necessary for commissioning coolant distribution units (CDUs) in direct-to-chip liquid-cooled data centers. It carefully investigates the hydraulic, thermal, and energy aspects, establishing the groundwork for Liquid-to-Air (L2A) CDU data centers. A CDU's performance was evaluated under different conditions. First, the CDU's maximum cooling capacity was evaluated and found to be as high as 89.9 kW at an approach temperature difference (ATD) of 18.3 °C with a 0.83 heat exchanger effectiveness. Then, to assess the cooling performance and stability of the CDU, a low-power test and a transient thermohydraulic test were conducted. 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引用次数: 0
摘要
数据中心工作负载的快速增长和现代应用的日益复杂,导致计算性能和热管理之间的矛盾日益突出。传统的空气冷却系统虽然被广泛采用,但在处理下一代服务器不断增加的热足迹和更高的机架功率密度方面已达到极限,往往会导致热节流和效率降低,因此需要更高效的冷却解决方案。采用冷板的直接芯片液冷技术已成为一种前景广阔的解决方案,可为高性能服务器提供高效散热。然而,挑战依然存在,例如确保系统在不同热负荷下的稳定性,以及优化与现有基础设施的集成。本综合研究深入探讨了数据中心液体冷却领域,对直接到芯片液体冷却数据中心的冷却剂分配单元(CDU)调试所需的关键步骤和测试进行了新颖、全面的实验研究。它仔细研究了液压、热能和能源方面的问题,为液空(L2A)CDU 数据中心奠定了基础。CDU 的性能在不同条件下进行了评估。首先,对 CDU 的最大冷却能力进行了评估,发现在接近温差(ATD)为 18.3 °C、热交换器效率为 0.83 的条件下,CDU 的最大冷却能力高达 89.9 千瓦。然后,为了评估 CDU 的冷却性能和稳定性,进行了低功率测试和瞬态热液压测试。结果表明,在低热负荷时,风扇转速的波动会导致供流体温度(SFT)不稳定。尽管如此,在不同的供气温度(SAT)下,热去除率保持不变,在不同的 SAT 下,100% 热负荷(86 kW)时的部分功率使用效率(PPUE)达到了 1.042。这项研究为提高 L2A CDU 性能奠定了基础,并为克服数据中心当前的冷却限制提供了实用见解。
Parameters of performance: A deep dive into liquid-to-air CDU assessment
The rapid growth in data center workloads and the increasing complexity of modern applications have led to significant contradictions between computational performance and thermal management. Traditional air-cooling systems, while widely adopted, are reaching their limits in handling the rising thermal footprints and higher rack power densities of next-generation servers, often resulting in thermal throttling and decreased efficiency, emphasizing the need for more efficient cooling solutions. Direct-to-chip liquid cooling with cold plates has emerged as a promising solution, providing efficient heat dissipation for high-performance servers. However, challenges remain, such as ensuring system stability under varying thermal loads and optimizing integration with existing infrastructure. This comprehensive study digs into the area of data center liquid cooling, providing a novel, comprehensive experimental investigation of the critical steps and tests necessary for commissioning coolant distribution units (CDUs) in direct-to-chip liquid-cooled data centers. It carefully investigates the hydraulic, thermal, and energy aspects, establishing the groundwork for Liquid-to-Air (L2A) CDU data centers. A CDU's performance was evaluated under different conditions. First, the CDU's maximum cooling capacity was evaluated and found to be as high as 89.9 kW at an approach temperature difference (ATD) of 18.3 °C with a 0.83 heat exchanger effectiveness. Then, to assess the cooling performance and stability of the CDU, a low-power test and a transient thermohydraulic test were conducted. The results showed instability in the supply fluid temperature (SFT) caused by the oscillation in fan speed at low thermal loads. Despite this, heat removal rates remained constant across varying supply air temperatures (SATs), and a partial power usage effectiveness (PPUE) of 1.042 was achieved at 100 % heat load (86 kW) under different SATs. This research sets a foundation for improving L2A CDU performance and offers practical insights for overcoming current cooling limitations in data centers.
期刊介绍:
Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.