T 型碳薄膜的纳米压痕行为:分子动力学研究

IF 3.8 2区 工程技术 Q1 ENGINEERING, MECHANICAL Acta Mechanica Sinica Pub Date : 2024-11-08 DOI:10.1007/s10409-024-24222-x
Runhua Zhou  (, ), Changjin Huang  (, ), Narasimalu Srikanth, Lichun Bai  (, ), Mao See Wu  (, )
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引用次数: 0

摘要

T 碳是碳材料的一种新同素异形体,具有高硬度和低密度的特点。然而,T-碳薄膜在纳米压痕作用下的硬化机理仍然难以捉摸。本研究利用分子动力学模拟探讨了 T 碳薄膜在纳米压痕作用下随加载速度和温度变化的硬化机理。结果表明,在给定温度下,加载速度的增加会提高纳米压痕力。纳米压痕力增加的原因是石墨化,而石墨化与 T 型碳薄膜中四面体结构的断裂有关。然而,温度升高导致的石墨化增加会降低给定加载速度下的纳米压痕力。石墨化的增加既受四面体断裂的影响,也受四面体间键角变形的影响。这归因于温度升高时 T 碳薄膜热稳定性的丧失和密度的降低。这些发现对设计满足特定应用要求的纳米器件具有重要意义。
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Nanoindentation behavior in T-carbon thin films: a molecular dynamics study

T-carbon is a new allotrope of carbon materials, and it displays high hardness and low density. Nevertheless, the hardening mechanisms of T-carbon thin films under nanoindentation remain elusive. This work utilizes molecular dynamics simulation to explore the hardening mechanisms of T-carbon thin films under nanoindentation with variations of loading velocities and temperatures. The results reveal that a loading velocity increase at a given temperature raises the nanoindentation force. The increase in nanoindentation force is due to graphitization, which is related to the fracture of tetrahedral structures in T-carbon thin films. However, increased graphitization caused by an increased temperature lowers the nanoindentation force at a given loading velocity. The increased graphitization is influenced by both the fractured tetrahedrons and the deformation of inter-tetrahedron bond angles. This is attributed to the loss of thermal stability and the lower density of T-carbon thin films as the temperature increases. These findings have significant implications for the design of nanodevices for specific application requirements.

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来源期刊
Acta Mechanica Sinica
Acta Mechanica Sinica 物理-工程:机械
CiteScore
5.60
自引率
20.00%
发文量
1807
审稿时长
4 months
期刊介绍: Acta Mechanica Sinica, sponsored by the Chinese Society of Theoretical and Applied Mechanics, promotes scientific exchanges and collaboration among Chinese scientists in China and abroad. It features high quality, original papers in all aspects of mechanics and mechanical sciences. Not only does the journal explore the classical subdivisions of theoretical and applied mechanics such as solid and fluid mechanics, it also explores recently emerging areas such as biomechanics and nanomechanics. In addition, the journal investigates analytical, computational, and experimental progresses in all areas of mechanics. Lastly, it encourages research in interdisciplinary subjects, serving as a bridge between mechanics and other branches of engineering and the sciences. In addition to research papers, Acta Mechanica Sinica publishes reviews, notes, experimental techniques, scientific events, and other special topics of interest. Related subjects » Classical Continuum Physics - Computational Intelligence and Complexity - Mechanics
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