在高电场下采用自适应阳极氧化法增强 Al2O3/Ba0.5Sr0.5TiO3/Al2O3 复合薄膜的异质面稳定性

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2024-11-25 DOI:10.1007/s10854-024-13922-5
Jinhua Lao, Jianwen Chen, Dengyan Hu, Wenbo Zhu, Si Liu, Xiucai Wang, Shaopeng Zhou, Peng Xiao, Xinmei Yu, Zhongbin Pan
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引用次数: 0

摘要

利用多种介电材料是提高介电薄膜储能性能的有效方法。然而,异质界面是多层介质薄膜的底层,经常会引起缺陷诱导击穿。为了优化电介质异质面,提出了自适应阳极氧化方法。通过在高电场下阳极氧化 Al/Ba0.5Sr0.5TiO3/Al 薄膜,制备了单阳极氧化 Al2O3/Ba0.5Sr0.5TiO3/Al2O3 (SAB) 薄膜。经过优化,Al2O3/Ba0.5Sr0.5TiO3 的突变界面变得更加紧凑,形成了稳定的过渡异质界面。SAB 薄膜表现出优异的电气性能,包括 580 MV m-1 的击穿强度、16.4 J cm-3 的储能密度以及从 0 到 225 MV m-1 的漏电流密度 < 10-6 A cm-2。有限元模拟演示了高电场下的缺陷自我修复过程。这项研究为制造具有高击穿强度和储能密度的多层电介质薄膜提供了一种可行的策略。
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Enhancing the heterointerface stability of Al2O3/Ba0.5Sr0.5TiO3/Al2O3 composite thin films by adaptive anodizing method under high electric field

The utilization of multiple dielectric materials is an effective way to improve the energy storage performance of dielectric thin films. However, the heterointerfaces are the underbelly of multilayer dielectric thin films, which often causes defect-induced breakdown. The adaptive anodizing method was proposed to optimize dielectric heterointerface. The single anodization Al2O3/Ba0.5Sr0.5TiO3/Al2O3 (SAB) thin films were fabricated by anodizing Al/Ba0.5Sr0.5TiO3/Al thin films under the high electric field. The Al2O3/Ba0.5Sr0.5TiO3 abrupt interfaces had been optimized to become more compact, forming stable transition heterointerfaces. The SAB thin films exhibit excellent electric properties, including a breakdown strength of 580 MV m−1, an energy storage density of 16.4 J cm−3, and a leakage current density < 10–6 A cm−2 from 0 to 225 MV m−1. The finite element simulation was constructed to demonstrate the defect self-repair process under high electric field. This work offers a promising strategy to fabricate multilayer dielectric thin films with high breakdown strength and energy storage density.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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