掺铜 Ca0.61Nd0.26TiO3 陶瓷中 Ti4+ 的抗还原性和更高的品质因数

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2024-11-29 DOI:10.1007/s10854-024-13938-x
Dawei Gao, Juncheng Ma, Jiafen Zhang, Qingang Shi, Zhe Xiong, Xing Zhang, Bin Tang
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引用次数: 0

摘要

出现 "暗孔 "是 TiO2 基陶瓷中的一种常见现象,它是由于 Ti4+ 在高温和低氧分压烧结条件下发生还原而造成的。为了实现低介电损耗,本文设计并制备了 Ca0.61Nd0.26Ti1-xCuxO3 陶瓷。结果表明,适度掺杂氧化铜不仅能提高绝缘电阻率和 Q × f 值,还能降低正 τf 值。Ca0.61Nd0.26Ti0.98Cu0.02O3 样品的 Q × f 值最高,达到 16,895 GHz,有助于微波器件的小型化和插入损耗。
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Anti-reduction of Ti4+ and improved quality factor in Cu-doped Ca0.61Nd0.26TiO3 ceramics

The occurrence of "dark holes" is a common phenomenon in TiO2-based ceramics, resulting from the reduction of Ti4+ under high-temperature and low-oxygen partial pressure sintering conditions. To achieve low dielectric loss, Ca0.61Nd0.26Ti1-xCuxO3 ceramics were designed and prepared in this work. The results indicate that moderate doping of CuO not only enhances insulation resistivity and Q × f value but also reduces the positive τf value. The Ca0.61Nd0.26Ti0.98Cu0.02O3 sample exhibited the highest Q × f value of 16,895 GHz, contributing to the miniaturization and insertion loss of microwave devices.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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