锂植入对二氧化钛薄膜结构和光物理性质的影响

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2024-11-27 DOI:10.1007/s10854-024-13926-1
Sulakshana Mondal, Amaresh Das, Durga Basak
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引用次数: 0

摘要

我们在此研究了缺陷对锂离子植入 TiO2 薄膜的结构和光物理性质的影响,锂离子植入的通量为 1 × 1014 至 1 × 1015 离子/cm2。所有薄膜都显示出四方锐钛矿结构,但植入薄膜的 (101) 峰的较高角度偏移证实了锂在 Ti 位点的掺杂。我们的 X 射线光电子能谱研究也证实了这一结果。研究结果还表明,随着锂离子通量的增加,植入样品中氧空位和/或 Ti3+ 物种等缺陷的形成也会增加。这也得到了 "离子在物质中的停止和范围"(SRIM)理论模拟的支持。氧空位-Ti3+ 缺陷的引入成为重组中心,导致锂植入后 TiO2 薄膜的发射特性发生显著变化,光响应特性降低。
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Impact on the structural and photophysical properties of TiO2 films owing to Li implantation

We investigated here the effect of defects on the structural and photophysical properties of TiO2 films implanted with Li ions with fluences from 1 × 1014 to 1 × 1015 ions/cm2. All the films showed tetragonal anatase structure but higher angle shift of the (101) peak of implanted films confirms Li doping in Ti site. This result is also supported by our X-Ray photoelectron spectroscopy study. The results also indicated that with an increase in Li ion fluence, formation of defects like oxygen vacancy and/or Ti3+ species increases in implanted samples. This is also supported by theoretical “stopping and range of ions in matter” (SRIM) simulations. The introduction of oxygen vacancy-Ti3+ defects act as recombination centers which gives rise to significant change in emission properties and decrease the photoresponse properties of the TiO2 films after Li implantation.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
期刊最新文献
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