{"title":"自包装喷墨印刷垂直集成射频协同设计带通滤波平衡器","authors":"Joe Steele;Dimitra Psychogiou","doi":"10.1109/TCPMT.2024.3469868","DOIUrl":null,"url":null,"abstract":"A new class of self-packaged RF co-designed bandpass filtering baluns (BPF-Bs) is proposed with alongside a novel integration scheme utilizing vertically integrated inkjet-printed multicoupled transmission lines (TLs). Furthermore, the manuscript outlines a comprehensive design methodology for their realization, exploiting the design freedom afforded by a two-material inkjet printing process, which enables the creation of tightly coupled vertically integrated TLs. The concept has been verified experimentally through the manufacturing and testing of wideband (WB) and ultrawideband (UWB) BPF-B prototypes, having \n<inline-formula> <tex-math>${f} _{0} = 5$ </tex-math></inline-formula>\n GHz, footprints of \n<inline-formula> <tex-math>$0.019~\\lambda _{g}^{2}$ </tex-math></inline-formula>\n and \n<inline-formula> <tex-math>$0.025~\\lambda _{g}^{2}$ </tex-math></inline-formula>\n, and 3 dB fractional bandwidths (FBWs) of 24% and 111%, respectively. For the WB and UWB designs, power loss, phase imbalance (PI), and amplitude imbalance (AI) were measured between 4.4 and 7.4 dB and 1.8–4.8 dB, \n<inline-formula> <tex-math>$4^{\\circ }~\\pm ~4^{\\circ }$ </tex-math></inline-formula>\n and \n<inline-formula> <tex-math>$2^{\\circ }~\\pm ~2^{\\circ }$ </tex-math></inline-formula>\n, and \n<inline-formula> <tex-math>$0.45~\\pm ~0.45$ </tex-math></inline-formula>\n dB and \n<inline-formula> <tex-math>$0.4~\\pm ~0.4$ </tex-math></inline-formula>\n dB, respectively.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2124-2127"},"PeriodicalIF":2.3000,"publicationDate":"2024-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10697187","citationCount":"0","resultStr":"{\"title\":\"Self-Packaged Inkjet-Printed Vertically Integrated RF Co-Designed Bandpass Filtering Baluns\",\"authors\":\"Joe Steele;Dimitra Psychogiou\",\"doi\":\"10.1109/TCPMT.2024.3469868\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new class of self-packaged RF co-designed bandpass filtering baluns (BPF-Bs) is proposed with alongside a novel integration scheme utilizing vertically integrated inkjet-printed multicoupled transmission lines (TLs). Furthermore, the manuscript outlines a comprehensive design methodology for their realization, exploiting the design freedom afforded by a two-material inkjet printing process, which enables the creation of tightly coupled vertically integrated TLs. The concept has been verified experimentally through the manufacturing and testing of wideband (WB) and ultrawideband (UWB) BPF-B prototypes, having \\n<inline-formula> <tex-math>${f} _{0} = 5$ </tex-math></inline-formula>\\n GHz, footprints of \\n<inline-formula> <tex-math>$0.019~\\\\lambda _{g}^{2}$ </tex-math></inline-formula>\\n and \\n<inline-formula> <tex-math>$0.025~\\\\lambda _{g}^{2}$ </tex-math></inline-formula>\\n, and 3 dB fractional bandwidths (FBWs) of 24% and 111%, respectively. For the WB and UWB designs, power loss, phase imbalance (PI), and amplitude imbalance (AI) were measured between 4.4 and 7.4 dB and 1.8–4.8 dB, \\n<inline-formula> <tex-math>$4^{\\\\circ }~\\\\pm ~4^{\\\\circ }$ </tex-math></inline-formula>\\n and \\n<inline-formula> <tex-math>$2^{\\\\circ }~\\\\pm ~2^{\\\\circ }$ </tex-math></inline-formula>\\n, and \\n<inline-formula> <tex-math>$0.45~\\\\pm ~0.45$ </tex-math></inline-formula>\\n dB and \\n<inline-formula> <tex-math>$0.4~\\\\pm ~0.4$ </tex-math></inline-formula>\\n dB, respectively.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"14 11\",\"pages\":\"2124-2127\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-09-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10697187\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10697187/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10697187/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A new class of self-packaged RF co-designed bandpass filtering baluns (BPF-Bs) is proposed with alongside a novel integration scheme utilizing vertically integrated inkjet-printed multicoupled transmission lines (TLs). Furthermore, the manuscript outlines a comprehensive design methodology for their realization, exploiting the design freedom afforded by a two-material inkjet printing process, which enables the creation of tightly coupled vertically integrated TLs. The concept has been verified experimentally through the manufacturing and testing of wideband (WB) and ultrawideband (UWB) BPF-B prototypes, having
${f} _{0} = 5$
GHz, footprints of
$0.019~\lambda _{g}^{2}$
and
$0.025~\lambda _{g}^{2}$
, and 3 dB fractional bandwidths (FBWs) of 24% and 111%, respectively. For the WB and UWB designs, power loss, phase imbalance (PI), and amplitude imbalance (AI) were measured between 4.4 and 7.4 dB and 1.8–4.8 dB,
$4^{\circ }~\pm ~4^{\circ }$
and
$2^{\circ }~\pm ~2^{\circ }$
, and
$0.45~\pm ~0.45$
dB and
$0.4~\pm ~0.4$
dB, respectively.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.