{"title":"用于紧凑分支线耦合器设计的自封装慢波金属集成共面波导(MICPW)","authors":"Huajiao Shen;Fanyi Meng;Yongqiang Wang;Kaixue Ma","doi":"10.1109/TCPMT.2024.3470796","DOIUrl":null,"url":null,"abstract":"This article proposes a slow wave metal-integrated coplanar waveguide (MICPW) with low loss and self-packaging. Since almost no substrate is used for the MICPW, there is almost no dielectric loss. The signal trace of the MICPW is embedded inside the multilayer metal boards, the overall circuit is self-packaged and there is almost no radiation loss. The slow wave effect is generated by using the shunt stub. The proposed slow wave MICPW is utilized to design compact branch-line couplers. Two types of supporting structures for the suspended metal lines are presented. Two design cases operating at 3.5 and 1.8 GHz are implemented, and the core circuit areas are <inline-formula> <tex-math>$0.13\\lambda $ </tex-math></inline-formula>g <inline-formula> <tex-math>$\\times 0.26\\lambda $ </tex-math></inline-formula>g and <inline-formula> <tex-math>$0.14\\lambda $ </tex-math></inline-formula>g <inline-formula> <tex-math>$\\times 0.17\\lambda $ </tex-math></inline-formula>g, which shows a size reduction of 46% and 62% compared to the traditional counterparts. The measured loss percentages are only 3% and 1.14%, which are much smaller than that of the other reported works.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"196-205"},"PeriodicalIF":2.3000,"publicationDate":"2024-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Self-Packaged Slow Wave Metal-Integrated Coplanar Waveguide (MICPW) for Compact Branch-Line Coupler Design\",\"authors\":\"Huajiao Shen;Fanyi Meng;Yongqiang Wang;Kaixue Ma\",\"doi\":\"10.1109/TCPMT.2024.3470796\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article proposes a slow wave metal-integrated coplanar waveguide (MICPW) with low loss and self-packaging. Since almost no substrate is used for the MICPW, there is almost no dielectric loss. The signal trace of the MICPW is embedded inside the multilayer metal boards, the overall circuit is self-packaged and there is almost no radiation loss. The slow wave effect is generated by using the shunt stub. The proposed slow wave MICPW is utilized to design compact branch-line couplers. Two types of supporting structures for the suspended metal lines are presented. Two design cases operating at 3.5 and 1.8 GHz are implemented, and the core circuit areas are <inline-formula> <tex-math>$0.13\\\\lambda $ </tex-math></inline-formula>g <inline-formula> <tex-math>$\\\\times 0.26\\\\lambda $ </tex-math></inline-formula>g and <inline-formula> <tex-math>$0.14\\\\lambda $ </tex-math></inline-formula>g <inline-formula> <tex-math>$\\\\times 0.17\\\\lambda $ </tex-math></inline-formula>g, which shows a size reduction of 46% and 62% compared to the traditional counterparts. The measured loss percentages are only 3% and 1.14%, which are much smaller than that of the other reported works.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"15 1\",\"pages\":\"196-205\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-09-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10700769/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10700769/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
摘要
提出了一种低损耗、自封装的慢波金属集成共面波导(MICPW)。由于MICPW几乎不使用衬底,因此几乎没有介电损耗。MICPW的信号走线嵌入多层金属板内,整体电路自封装,几乎没有辐射损耗。慢波效应是通过使用分流管产生的。所提出的慢波MICPW用于设计紧凑的分支线耦合器。提出了两种悬吊金属线的支撑结构。实现了两种工作在3.5 GHz和1.8 GHz的设计案例,核心电路面积分别为$0.13\lambda $ g $ × 0.26\lambda $ g和$0.14\lambda $ g $ × 0.17\lambda $ g,与传统电路相比,尺寸分别减小了46%和62%。实测损失率仅为3%和1.14%,远低于其他已报道的作品。
This article proposes a slow wave metal-integrated coplanar waveguide (MICPW) with low loss and self-packaging. Since almost no substrate is used for the MICPW, there is almost no dielectric loss. The signal trace of the MICPW is embedded inside the multilayer metal boards, the overall circuit is self-packaged and there is almost no radiation loss. The slow wave effect is generated by using the shunt stub. The proposed slow wave MICPW is utilized to design compact branch-line couplers. Two types of supporting structures for the suspended metal lines are presented. Two design cases operating at 3.5 and 1.8 GHz are implemented, and the core circuit areas are $0.13\lambda $ g $\times 0.26\lambda $ g and $0.14\lambda $ g $\times 0.17\lambda $ g, which shows a size reduction of 46% and 62% compared to the traditional counterparts. The measured loss percentages are only 3% and 1.14%, which are much smaller than that of the other reported works.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.