Woojin Yang, Minju Park, Yoohyeon Choi, Il-Soo Park, Jae Won Yun, Heewoong Yoon, Dongjae Lee, Jiwon Seo, Heesuk Kim, Jae Hong Kim
{"title":"生物可降解的离子热电复合材料，通过自组装的二肽和深共晶溶剂","authors":"Woojin Yang, Minju Park, Yoohyeon Choi, Il-Soo Park, Jae Won Yun, Heewoong Yoon, Dongjae Lee, Jiwon Seo, Heesuk Kim, Jae Hong Kim","doi":"10.1007/s42114-025-01239-8","DOIUrl":null,"url":null,"abstract":"<div><p>The growing demand for biodegradable conductive composites is driven by the need to mitigate electronic waste and advance bioelectronics for healthcare applications. Self-assembled peptide composites, particularly diphenylalanine (FF) derivatives, represent a promising class of materials for such electronics due to their inherent biodegradability and ease of hybridization with functional materials. However, the integration of ionic species with these peptides is often limited by the disruption of non-covalent interactions between FF derivatives. In this study, we developed biodegradable, ionic thermoelectric composites by co-assembling Fmoc-FF with deep eutectic solvents (DESs) composed of choline chloride (ChCl) and ethylene glycol (EG). Spectroscopic analyses revealed that Fmoc-FF formed eutectogels through π-π interactions between Fmoc groups, resulting in a highly porous colloidal network. The Fmoc-FF eutectogels exhibited an ionic conductivity of up to 47.5 mS·cm<sup>−1</sup> and a Seebeck coefficient of 7.39 mV·K<sup>−1</sup>, making them suitable for heat harvesting. Additionally, they were entirely degraded within 48 h under proteolytic conditions, confirming their biodegradability. The eutectogels also displayed self-healing and shear-thinning behaviors, highlighting compatibility with additive manufacturing techniques for device integration.</p><h3>Graphical Abstract</h3>\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":7220,"journal":{"name":"Advanced Composites and Hybrid Materials","volume":"8 1","pages":""},"PeriodicalIF":23.2000,"publicationDate":"2025-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://link.springer.com/content/pdf/10.1007/s42114-025-01239-8.pdf","citationCount":"0","resultStr":"{\"title\":\"Biodegradable, ionic thermoelectric composites via self-assembly of dipeptides and deep eutectic solvents\",\"authors\":\"Woojin Yang, Minju Park, Yoohyeon Choi, Il-Soo Park, Jae Won Yun, Heewoong Yoon, Dongjae Lee, Jiwon Seo, Heesuk Kim, Jae Hong Kim\",\"doi\":\"10.1007/s42114-025-01239-8\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The growing demand for biodegradable conductive composites is driven by the need to mitigate electronic waste and advance bioelectronics for healthcare applications. Self-assembled peptide composites, particularly diphenylalanine (FF) derivatives, represent a promising class of materials for such electronics due to their inherent biodegradability and ease of hybridization with functional materials. However, the integration of ionic species with these peptides is often limited by the disruption of non-covalent interactions between FF derivatives. In this study, we developed biodegradable, ionic thermoelectric composites by co-assembling Fmoc-FF with deep eutectic solvents (DESs) composed of choline chloride (ChCl) and ethylene glycol (EG). Spectroscopic analyses revealed that Fmoc-FF formed eutectogels through π-π interactions between Fmoc groups, resulting in a highly porous colloidal network. The Fmoc-FF eutectogels exhibited an ionic conductivity of up to 47.5 mS·cm<sup>−1</sup> and a Seebeck coefficient of 7.39 mV·K<sup>−1</sup>, making them suitable for heat harvesting. Additionally, they were entirely degraded within 48 h under proteolytic conditions, confirming their biodegradability. The eutectogels also displayed self-healing and shear-thinning behaviors, highlighting compatibility with additive manufacturing techniques for device integration.</p><h3>Graphical Abstract</h3>\\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":7220,\"journal\":{\"name\":\"Advanced Composites and Hybrid Materials\",\"volume\":\"8 1\",\"pages\":\"\"},\"PeriodicalIF\":23.2000,\"publicationDate\":\"2025-01-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://link.springer.com/content/pdf/10.1007/s42114-025-01239-8.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Composites and Hybrid Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s42114-025-01239-8\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, COMPOSITES\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Composites and Hybrid Materials","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s42114-025-01239-8","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COMPOSITES","Score":null,"Total":0}
Biodegradable, ionic thermoelectric composites via self-assembly of dipeptides and deep eutectic solvents
The growing demand for biodegradable conductive composites is driven by the need to mitigate electronic waste and advance bioelectronics for healthcare applications. Self-assembled peptide composites, particularly diphenylalanine (FF) derivatives, represent a promising class of materials for such electronics due to their inherent biodegradability and ease of hybridization with functional materials. However, the integration of ionic species with these peptides is often limited by the disruption of non-covalent interactions between FF derivatives. In this study, we developed biodegradable, ionic thermoelectric composites by co-assembling Fmoc-FF with deep eutectic solvents (DESs) composed of choline chloride (ChCl) and ethylene glycol (EG). Spectroscopic analyses revealed that Fmoc-FF formed eutectogels through π-π interactions between Fmoc groups, resulting in a highly porous colloidal network. The Fmoc-FF eutectogels exhibited an ionic conductivity of up to 47.5 mS·cm−1 and a Seebeck coefficient of 7.39 mV·K−1, making them suitable for heat harvesting. Additionally, they were entirely degraded within 48 h under proteolytic conditions, confirming their biodegradability. The eutectogels also displayed self-healing and shear-thinning behaviors, highlighting compatibility with additive manufacturing techniques for device integration.
期刊介绍：
Advanced Composites and Hybrid Materials is a leading international journal that promotes interdisciplinary collaboration among materials scientists, engineers, chemists, biologists, and physicists working on composites, including nanocomposites. Our aim is to facilitate rapid scientific communication in this field.
The journal publishes high-quality research on various aspects of composite materials, including materials design, surface and interface science/engineering, manufacturing, structure control, property design, device fabrication, and other applications. We also welcome simulation and modeling studies that are relevant to composites. Additionally, papers focusing on the relationship between fillers and the matrix are of particular interest.
Our scope includes polymer, metal, and ceramic matrices, with a special emphasis on reviews and meta-analyses related to materials selection. We cover a wide range of topics, including transport properties, strategies for controlling interfaces and composition distribution, bottom-up assembly of nanocomposites, highly porous and high-density composites, electronic structure design, materials synergisms, and thermoelectric materials.
Advanced Composites and Hybrid Materials follows a rigorous single-blind peer-review process to ensure the quality and integrity of the published work.
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