基于聚(3,4 -乙烯二氧噻吩)聚苯乙烯磺酸盐(PEDOT: PSS)的高性价比柔性电阻温度传感器的全印刷技术制备

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-18 DOI:10.1007/s10854-025-14374-1
Sanam Mughal, Gul Hassan, Ahmed Shuja
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引用次数: 0

摘要

由于其适应性,灵活的温度传感器在各个领域变得越来越重要,这符合当前的趋势和技术进步,可以实现精确的测量。本研究的重点是利用银纳米粒子(AgNPs)与传感材料聚(3,4-乙烯二氧噻吩)聚苯乙烯磺酸盐(PEDOT:PSS)结合制成的数字间电极(IDE)优化具有各种模式的柔性温度传感器。该沉积工艺在聚对苯二甲酸乙二醇酯(PET)衬底上采用旋转涂层技术。所提出的传感器显示从290到360 K的检测范围,并有三种尺寸:5mm, 20mm和22mm。电阻-温度关系范围为0.2 Ω ~ 0.9 Ω、0.1 Ω ~ 0.9 Ω、2.0 Ω ~ 5.0 Ω。实验结果表明,高度为21 mm,宽度为2 mm的传感器在上述所有特性方面都具有优异的性能,满足实时制造和长期温度监测的要求。
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Fabrication of cost effective flexible resistive temperature sensor based on poly (3, 4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT: PSS) via all printed technologies

A flexible temperature sensor is becoming increasingly essential across various fields due to its adaptability, which aligns with current trends and technological advancements, enabling precise measurements. This study focuses on optimizing a flexible temperature sensor with various patterns using interdigital electrodes (IDE) made of silver nanoparticles (AgNPs) in conjunction with the sensing material Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS). The deposition process employs a spin-coating technique on a polyethylene terephthalate (PET) substrate. The proposed sensor exhibits a detection range from 290 to 360 K and comes in three sizes: 5 mm, 20 mm, and 22 mm. The resistance–temperature relationship ranges from 0.2 Ω to 0.9 Ω, 0.1 Ω to 0.9 Ω, and 2.0 Ω to 5.0 Ω. Experimental results indicate that a sensor with a height of 21 mm and a width of 2 mm yields superior performance across all the mentioned characteristics, meeting the requirements for real-time fabrication and long-term temperature monitoring.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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