Qianzhen Su;Zepeng Wang;Bo Zhang;Haoyuan Zhao;Dandan Liu;Jingliang Li;Xiaolong Wen;Jianhua Li
{"title":"利用微电子制造技术制造非晶线GMI磁传感器的方法","authors":"Qianzhen Su;Zepeng Wang;Bo Zhang;Haoyuan Zhao;Dandan Liu;Jingliang Li;Xiaolong Wen;Jianhua Li","doi":"10.1109/TCPMT.2024.3522319","DOIUrl":null,"url":null,"abstract":"The amorphous wire demonstrates good soft magnetic properties and the giant magnetoimpedance (GMI) effect. However, the amorphous wire with a diameter ranging from several micrometers to several tens of micrometers is soft and thin; thus, it is difficult to handle and fabricate to achieve a magnetic sensor. In addition, the electrical contact resistance of the amorphous wire with pads shows wide distribution due to the contact area being hard to control when welding. To solve these problems, this article proposed a microelectronic fabrication method for an amorphous wire-based magnetic sensor. Glass wafer was used as the supporting substrate of the amorphous wire, and nonphotosensitive polyimide resin was employed as the electroplating mask. Electroplating was performed to achieve the electrical interconnection between the amorphous wire and pads on the substrate. The structure fabricated above was composed of amorphous wire and a supporting glass substrate. Then, the enameled wire was uniformly wound around the fabricated structure as a signal pickup coil. The test results showed excellent linearity within the range of −0.6 to +0.6 Oe and a sensitivity of 6.38 V/Oe.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 2","pages":"236-243"},"PeriodicalIF":3.3000,"publicationDate":"2024-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Fabrication Method for Amorphous Wire GMI Magnetic Sensor With Microelectronic Manufacturing Technology\",\"authors\":\"Qianzhen Su;Zepeng Wang;Bo Zhang;Haoyuan Zhao;Dandan Liu;Jingliang Li;Xiaolong Wen;Jianhua Li\",\"doi\":\"10.1109/TCPMT.2024.3522319\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The amorphous wire demonstrates good soft magnetic properties and the giant magnetoimpedance (GMI) effect. However, the amorphous wire with a diameter ranging from several micrometers to several tens of micrometers is soft and thin; thus, it is difficult to handle and fabricate to achieve a magnetic sensor. In addition, the electrical contact resistance of the amorphous wire with pads shows wide distribution due to the contact area being hard to control when welding. To solve these problems, this article proposed a microelectronic fabrication method for an amorphous wire-based magnetic sensor. Glass wafer was used as the supporting substrate of the amorphous wire, and nonphotosensitive polyimide resin was employed as the electroplating mask. Electroplating was performed to achieve the electrical interconnection between the amorphous wire and pads on the substrate. The structure fabricated above was composed of amorphous wire and a supporting glass substrate. Then, the enameled wire was uniformly wound around the fabricated structure as a signal pickup coil. The test results showed excellent linearity within the range of −0.6 to +0.6 Oe and a sensitivity of 6.38 V/Oe.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"15 2\",\"pages\":\"236-243\"},\"PeriodicalIF\":3.3000,\"publicationDate\":\"2024-12-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10816017/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10816017/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A Fabrication Method for Amorphous Wire GMI Magnetic Sensor With Microelectronic Manufacturing Technology
The amorphous wire demonstrates good soft magnetic properties and the giant magnetoimpedance (GMI) effect. However, the amorphous wire with a diameter ranging from several micrometers to several tens of micrometers is soft and thin; thus, it is difficult to handle and fabricate to achieve a magnetic sensor. In addition, the electrical contact resistance of the amorphous wire with pads shows wide distribution due to the contact area being hard to control when welding. To solve these problems, this article proposed a microelectronic fabrication method for an amorphous wire-based magnetic sensor. Glass wafer was used as the supporting substrate of the amorphous wire, and nonphotosensitive polyimide resin was employed as the electroplating mask. Electroplating was performed to achieve the electrical interconnection between the amorphous wire and pads on the substrate. The structure fabricated above was composed of amorphous wire and a supporting glass substrate. Then, the enameled wire was uniformly wound around the fabricated structure as a signal pickup coil. The test results showed excellent linearity within the range of −0.6 to +0.6 Oe and a sensitivity of 6.38 V/Oe.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.