利用微电子制造技术制造非晶线GMI磁传感器的方法

IF 3.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-26 DOI:10.1109/TCPMT.2024.3522319
Qianzhen Su;Zepeng Wang;Bo Zhang;Haoyuan Zhao;Dandan Liu;Jingliang Li;Xiaolong Wen;Jianhua Li
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引用次数: 0

摘要

该非晶线具有良好的软磁性能和巨磁阻抗效应。而直径从几微米到几十微米不等的非晶态线则柔软而纤细;因此,难以处理和制造以实现磁传感器。此外,由于焊时接触面积难以控制,带焊盘的非晶丝的电接触电阻分布较宽。为了解决这些问题,本文提出了一种基于非晶线的磁传感器的微电子制造方法。采用玻璃晶片作为非晶线的支撑基板,采用非光敏聚酰亚胺树脂作为电镀掩膜。电镀是为了实现非晶线和衬底上的焊盘之间的电互连。上述结构由非晶丝和支撑玻璃基板组成。然后,将漆包线均匀缠绕在制成的结构上作为信号拾取线圈。测试结果表明,在−0.6 ~ +0.6 Oe范围内线性良好,灵敏度为6.38 V/Oe。
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A Fabrication Method for Amorphous Wire GMI Magnetic Sensor With Microelectronic Manufacturing Technology
The amorphous wire demonstrates good soft magnetic properties and the giant magnetoimpedance (GMI) effect. However, the amorphous wire with a diameter ranging from several micrometers to several tens of micrometers is soft and thin; thus, it is difficult to handle and fabricate to achieve a magnetic sensor. In addition, the electrical contact resistance of the amorphous wire with pads shows wide distribution due to the contact area being hard to control when welding. To solve these problems, this article proposed a microelectronic fabrication method for an amorphous wire-based magnetic sensor. Glass wafer was used as the supporting substrate of the amorphous wire, and nonphotosensitive polyimide resin was employed as the electroplating mask. Electroplating was performed to achieve the electrical interconnection between the amorphous wire and pads on the substrate. The structure fabricated above was composed of amorphous wire and a supporting glass substrate. Then, the enameled wire was uniformly wound around the fabricated structure as a signal pickup coil. The test results showed excellent linearity within the range of −0.6 to +0.6 Oe and a sensitivity of 6.38 V/Oe.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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