基于GaAs-IPD的Chebyshev和准椭圆响应集总双频变压器

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-27 DOI:10.1109/TCPMT.2024.3523326
Yu-Chen Wei;Cong Wang;Jing-Yang Gao;Fan-Yi Meng;Xiao-Long Wang;Yong-Le Wu;Nam-Young Kim
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引用次数: 0

摘要

本文提出了具有切比雪夫响应和准椭圆响应的双频(DB)变压器的设计方法。与传统变压器相比,该方法不仅可以实现带宽和阻抗变换比的任意组合,而且可以实现典型的切比雪夫响应或方便地引入准椭圆响应的任意传输零点(TZs)。采用GaAs集成无源器件(IPD)技术制备的超紧凑集总样机成功实现了阻抗转换范围为10 ~ 50~\Omega $的DB Chebyshev变压器(DB- ct)和DB准椭圆变压器(DB- qet),工作频率分别为2.25 GHz和3.1 GHz。该器件在两个工作频段的带宽均达到22%,带内插入损耗分别最小为1.3 dB和1.45 dB。由于DB-QET的集总形式和引入的TZs,可以观察到高达七阶的谐波抑制和快速的带外衰减。此外,在器件中加入接地屏蔽金属栅栏(GSMF)结构,显示出优异的电磁干扰屏蔽性能。所设计器件的仿真结果与实测结果具有良好的一致性。
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Lumped Dual-Band Transformer With Chebyshev and Quasi-Elliptic Responses Based on GaAs-IPD
In this article, the design method of dual-band (DB) transformers with Chebyshev and quasi-elliptic responses has been proposed. This method not only enables arbitrary combinations of bandwidth and impedance transformation ratio but also achieves typical Chebyshev responses or conveniently introduces arbitrary transmission zeros (TZs) for quasi-elliptic responses, compared to conventional transformers. Ultra-compact lumped prototypes, fabricated using GaAs integrated passive device (IPD) technology, successfully realize DB Chebyshev transformer (DB-CT) and DB quasi-elliptic transformer (DB-QET) with impedance transformations from 10 to $50~\Omega $ , operating at 2.25 and 3.1 GHz, respectively. The devices achieve a bandwidth of 22% in both operating bands, with minimum in-band insertion losses of 1.3 and 1.45 dB, respectively. Due to the lumped form and the introduced TZs of DB-QET, up to seventh-order harmonic suppression and rapid out-of-band attenuation can be observed. Additionally, the grounded-shielding metal fence (GSMF) structure added to the devices demonstrated excellent electromagnetic (EM) interference shielding performance. The simulated and measured results of the proposed devices exhibit good consistency.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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