陶瓷体积分数对3-2型复合材料的影响

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-20 DOI:10.1007/s10854-025-14421-x
Sujie Jing, Hongwei Wang, Zhaoxian Yu
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引用次数: 0

摘要

3-2型陶瓷-空气复合材料是在1-3型压电复合材料的基础上改进而来的。3-2型压电材料由PZT-5A和空气复合材料制成。采用ANSYS有限元仿真软件,分析了压电陶瓷体积份额对3-2型陶瓷-空气复合材料振动模式、机电耦合系数、声阻抗的影响。3-2型压电复合材料的机电耦合系数保持在0.65,而声阻抗随着陶瓷体积百分比的增加从18.1MRaly增加到20.3MRaly。为了验证模拟数据,制备了三组不同陶瓷体积百分比的测试样品,对比发现实验数据与模拟数据基本一致。
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Effect of ceramic volume fraction on 3–2 type composites

Type 3–2 ceramic-air composites are improved from the structure of type 1–3 piezoelectric composites. Type 3–2 piezoelectric materials are made of PZT-5A and air composites. The effect of piezoelectric ceramic volume share on vibration patterns, electromechanical coupling coefficients, acoustic impedance of type 3–2 ceramic-air composites was analyzed using ANSYS finite element simulation software. The electromechanical coupling coefficient of the type 3–2 piezoelectric composites was found to be maintained at 0.65, while the acoustic impedance increased from 18.1MRaly to 20.3MRaly with the increase of the ceramic volume percentage. To validate the simulated data, three sets of test samples with different ceramic volume percentages were prepared, and the experimental and simulated data were found to be essentially identical upon comparison.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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