STATE:一种快速、可靠地预测阻性RAM寿命的测试结构

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Device and Materials Reliability Pub Date : 2022-10-10 DOI:10.1109/TDMR.2022.3213191
H. Aziza;J. Postel-Pellerin;M. Moreau
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引用次数: 2

摘要

表征和量化电阻性RAM器件的耐用性对于评估其集成在电子系统中的可靠性至关重要。本文提出了一种新的表征方法,用于快速检测rram耐久性试验中的可靠性问题。为此,采用一种由一组不可寻址的随机存取存储器单元组成的测试结构,并将所有存储器单元并行连接。该测试结构填补了隔离单元和电路级耐久性测试之间的空白,因为它结合了隔离单元的测试速度,同时提供来自多个设备的数据。在监测每个开关周期感兴趣的RRAM电气参数的同时进行耐久性测试。实验结果表明,大多数声称高续航能力的研究没有捕捉到所有的开关周期,或者只考虑一个孤立的细胞,导致了对续航能力的高估。最后,提出了一种基于复位方向RRAM电流传感的持久故障缓解方案,以提高其持久性能。
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STATE: A Test Structure for Rapid and Reliable Prediction of Resistive RAM Endurance
Characterizing and quantifying the endurance of Resistive RAM devices is critical to assess their reliability for integration in electronic systems. This paper proposes a novel characterization methodology for rapid detection of RRAMs reliability issues during endurance tests. A test structure consisting of an array of non-addressable RRAM memory cells with parallel connection of all the memory elements is used for this purpose. The test structure fills the gap between isolated cells and circuit level endurance tests as it combines the test speed of an isolated cell while providing at the same time data from multiple devices. Endurance tests are conducted while monitoring RRAM electrical parameters of interest for each switching cycle. Experimental results show that most studies that claimed high endurance without capturing all switching cycles, or by considering an isolated cell, lead to an overestimation of the endurance. Finally, an endurance failures mitigation scheme based on RRAM current sensing in the RESET direction is presented to improve the endurance.
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来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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