{"title":"STATE:一种快速、可靠地预测阻性RAM寿命的测试结构","authors":"H. Aziza;J. Postel-Pellerin;M. Moreau","doi":"10.1109/TDMR.2022.3213191","DOIUrl":null,"url":null,"abstract":"Characterizing and quantifying the endurance of Resistive RAM devices is critical to assess their reliability for integration in electronic systems. This paper proposes a novel characterization methodology for rapid detection of RRAMs reliability issues during endurance tests. A test structure consisting of an array of non-addressable RRAM memory cells with parallel connection of all the memory elements is used for this purpose. The test structure fills the gap between isolated cells and circuit level endurance tests as it combines the test speed of an isolated cell while providing at the same time data from multiple devices. Endurance tests are conducted while monitoring RRAM electrical parameters of interest for each switching cycle. Experimental results show that most studies that claimed high endurance without capturing all switching cycles, or by considering an isolated cell, lead to an overestimation of the endurance. Finally, an endurance failures mitigation scheme based on RRAM current sensing in the RESET direction is presented to improve the endurance.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"22 4","pages":"500-505"},"PeriodicalIF":2.5000,"publicationDate":"2022-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"STATE: A Test Structure for Rapid and Reliable Prediction of Resistive RAM Endurance\",\"authors\":\"H. Aziza;J. Postel-Pellerin;M. Moreau\",\"doi\":\"10.1109/TDMR.2022.3213191\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Characterizing and quantifying the endurance of Resistive RAM devices is critical to assess their reliability for integration in electronic systems. This paper proposes a novel characterization methodology for rapid detection of RRAMs reliability issues during endurance tests. A test structure consisting of an array of non-addressable RRAM memory cells with parallel connection of all the memory elements is used for this purpose. The test structure fills the gap between isolated cells and circuit level endurance tests as it combines the test speed of an isolated cell while providing at the same time data from multiple devices. Endurance tests are conducted while monitoring RRAM electrical parameters of interest for each switching cycle. Experimental results show that most studies that claimed high endurance without capturing all switching cycles, or by considering an isolated cell, lead to an overestimation of the endurance. Finally, an endurance failures mitigation scheme based on RRAM current sensing in the RESET direction is presented to improve the endurance.\",\"PeriodicalId\":448,\"journal\":{\"name\":\"IEEE Transactions on Device and Materials Reliability\",\"volume\":\"22 4\",\"pages\":\"500-505\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2022-10-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Device and Materials Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/9914640/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/9914640/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
STATE: A Test Structure for Rapid and Reliable Prediction of Resistive RAM Endurance
Characterizing and quantifying the endurance of Resistive RAM devices is critical to assess their reliability for integration in electronic systems. This paper proposes a novel characterization methodology for rapid detection of RRAMs reliability issues during endurance tests. A test structure consisting of an array of non-addressable RRAM memory cells with parallel connection of all the memory elements is used for this purpose. The test structure fills the gap between isolated cells and circuit level endurance tests as it combines the test speed of an isolated cell while providing at the same time data from multiple devices. Endurance tests are conducted while monitoring RRAM electrical parameters of interest for each switching cycle. Experimental results show that most studies that claimed high endurance without capturing all switching cycles, or by considering an isolated cell, lead to an overestimation of the endurance. Finally, an endurance failures mitigation scheme based on RRAM current sensing in the RESET direction is presented to improve the endurance.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.