用卷积神经网络检测ENIG和ENPIG表面处理的印刷电路板缺陷及其训练参数评估

Angelika Hable, Paul Tabatabai, H. L. Lichtenegger, Anton Scherr, T. Krivec, D. Gruber
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引用次数: 1

摘要

对印刷电路板(PCB)的质量检测提出了越来越高的要求。对所有生产的PCB进行全表面检查和检查系统的高缺陷检测精度正在成为有效质量管理的先决条件。与此同时,由于对电气设备的高需求,多年来对多氯联苯的需求不断增加。由于高生产率和所需的缺陷检测精度,人工检测不再可行。因此,自动检测系统越来越多地用于PCB生产的各个工艺步骤的质量控制。本文介绍了第一个用于检测化学镀镍浸金和化学镀镍浸钯浸金表面缺陷的自动检测系统。使用了预先训练的卷积神经网络(CNN)和滑动窗口方法。针对该分类问题,标记了由六种不同缺陷类型和仅包含无缺陷PCB图像的OK类组成的训练数据集。超参数学习率和批量大小对于CNN的不同训练运行是不同的,并且使用测试数据集评估网络在PCB缺陷检测中的性能。分析真阳性率、真阴性率和F1评分进行评估。我们的结果表明,在低批量和低学习率的情况下可以实现最佳性能。
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Detection of Printed Circuit Board Defects on ENIG and ENIPIG Surface Finishes with Convolutional Neural Networks and Evaluation of Training Parameters
Increasingly high demands are being placed on the quality inspection of printed circuit boards (PCBs). A full surface inspection of all produced PCBs and a high defect detection accuracy of the inspection system are becoming prerequisites for an efficient quality management. At the same time, the demand for PCBs is constantly increasing over the years due to the high demand for electrical devices. Human inspection is no longer feasible due to the high production rates and required defect detection accuracy. Therefore, automatic inspection systems are increasingly used for quality control in the various process steps of PCB production. In this article, the first automatic inspection system for detecting defects on Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Immersion Palladium Immersion Gold (ENIPIG) surfaces is presented. A pretrained convolutional neural network (CNN) and the sliding window approach are used. A training dataset consisting of six different defect types and an OK class containing only defect-free PCB images was labeled for this classification problem. The hyperparameters learning rate and batch size are varied for different training runs of the CNN, and the performance of the network in PCB defect detection is evaluated using a test dataset. The true-positive rate, truenegative rate, and F1-score were analyzed for the evaluation. Our results show that the best performances could be achieved at low batch sizes and low learning rates.
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来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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