Angelika Hable, Paul Tabatabai, H. L. Lichtenegger, Anton Scherr, T. Krivec, D. Gruber
{"title":"用卷积神经网络检测ENIG和ENPIG表面处理的印刷电路板缺陷及其训练参数评估","authors":"Angelika Hable, Paul Tabatabai, H. L. Lichtenegger, Anton Scherr, T. Krivec, D. Gruber","doi":"10.4071/001c.57717","DOIUrl":null,"url":null,"abstract":"Increasingly high demands are being placed on the quality inspection of printed circuit boards (PCBs). A full surface inspection of all produced PCBs and a high defect detection accuracy of the inspection system are becoming prerequisites for an efficient quality management. At the same time, the demand for PCBs is constantly increasing over the years due to the high demand for electrical devices. Human inspection is no longer feasible due to the high production rates and required defect detection accuracy. Therefore, automatic inspection systems are increasingly used for quality control in the various process steps of PCB production. In this article, the first automatic inspection system for detecting defects on Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Immersion Palladium Immersion Gold (ENIPIG) surfaces is presented. A pretrained convolutional neural network (CNN) and the sliding window approach are used. A training dataset consisting of six different defect types and an OK class containing only defect-free PCB images was labeled for this classification problem. The hyperparameters learning rate and batch size are varied for different training runs of the CNN, and the performance of the network in PCB defect detection is evaluated using a test dataset. The true-positive rate, truenegative rate, and F1-score were analyzed for the evaluation. Our results show that the best performances could be achieved at low batch sizes and low learning rates.","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Detection of Printed Circuit Board Defects on ENIG and ENIPIG Surface Finishes with Convolutional Neural Networks and Evaluation of Training Parameters\",\"authors\":\"Angelika Hable, Paul Tabatabai, H. L. Lichtenegger, Anton Scherr, T. Krivec, D. Gruber\",\"doi\":\"10.4071/001c.57717\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Increasingly high demands are being placed on the quality inspection of printed circuit boards (PCBs). A full surface inspection of all produced PCBs and a high defect detection accuracy of the inspection system are becoming prerequisites for an efficient quality management. At the same time, the demand for PCBs is constantly increasing over the years due to the high demand for electrical devices. Human inspection is no longer feasible due to the high production rates and required defect detection accuracy. Therefore, automatic inspection systems are increasingly used for quality control in the various process steps of PCB production. In this article, the first automatic inspection system for detecting defects on Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Immersion Palladium Immersion Gold (ENIPIG) surfaces is presented. A pretrained convolutional neural network (CNN) and the sliding window approach are used. A training dataset consisting of six different defect types and an OK class containing only defect-free PCB images was labeled for this classification problem. The hyperparameters learning rate and batch size are varied for different training runs of the CNN, and the performance of the network in PCB defect detection is evaluated using a test dataset. The true-positive rate, truenegative rate, and F1-score were analyzed for the evaluation. Our results show that the best performances could be achieved at low batch sizes and low learning rates.\",\"PeriodicalId\":35312,\"journal\":{\"name\":\"Journal of Microelectronics and Electronic Packaging\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectronics and Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/001c.57717\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/001c.57717","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
Detection of Printed Circuit Board Defects on ENIG and ENIPIG Surface Finishes with Convolutional Neural Networks and Evaluation of Training Parameters
Increasingly high demands are being placed on the quality inspection of printed circuit boards (PCBs). A full surface inspection of all produced PCBs and a high defect detection accuracy of the inspection system are becoming prerequisites for an efficient quality management. At the same time, the demand for PCBs is constantly increasing over the years due to the high demand for electrical devices. Human inspection is no longer feasible due to the high production rates and required defect detection accuracy. Therefore, automatic inspection systems are increasingly used for quality control in the various process steps of PCB production. In this article, the first automatic inspection system for detecting defects on Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Immersion Palladium Immersion Gold (ENIPIG) surfaces is presented. A pretrained convolutional neural network (CNN) and the sliding window approach are used. A training dataset consisting of six different defect types and an OK class containing only defect-free PCB images was labeled for this classification problem. The hyperparameters learning rate and batch size are varied for different training runs of the CNN, and the performance of the network in PCB defect detection is evaluated using a test dataset. The true-positive rate, truenegative rate, and F1-score were analyzed for the evaluation. Our results show that the best performances could be achieved at low batch sizes and low learning rates.
期刊介绍:
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.