Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation

Reliability is of a concern when designing new products. Extensive set of reliability tests are performed before a product is ready to be shipped for use. Drop testing, thermal cycling, power cycling, etc. are some of the tests used to assess the reliability of new electronic products. However, performing experimental study of every new design is costly and time consuming. Computational tools (such as finite element analysis software) are often employed to perform the required reliability analysis in a shorter time period and save valuable resources. One of the challenges of performing computational analysis is obtaining accurate material property data to be used for building accurate models. Extensive set of material characterization work needs to be carried out before an accurate model can be developed. For example, for a new printed circuit board (PCB), the bulk properties are often characterized by equipment such as thermomechanical analyzer and tensile testing machines to obtain the bulk properties t...