Process Development for Printed Copper with Surface Mount Devices On Inkjet Metallization

Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. Inkjet technology has gained much attention due to its low-cost, low material consumption, and capability for mass manufacturing. The preferred conductive metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the electrical and mechanical properties of copper. With the process developed, the resistivity of printed copper was found to be 5 times the bulk copper. In regards to adhesion to the polyimide film, mechanical shear load to failure was found to be within 15-20 gF. To demonstrate the complete process, commercial-off-the-shelf components are also mounted on the additively printed pads. Statistically, control charting technique is implemented to understand any process variation over long duration of prints.