I. Kaur, S. Mujahid, YubRaj Paudel, H. Rhee, Prashant Singh
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Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
Single unit cell thick lattice frame materials have applications in efficient heat exchangers. The present study is focused on strut-based sandwich-type configurations obtained through reticulation of unit cell topologies of Tetrakaidecahedron, Octet, and Rhombic dodecahedron shapes at a porosity of 0.9 with water as the working fluid. Interfacial heat transfer coefficient values on struts and endwalls were determined by imposing constant temperature boundary condition. Averaged heat transfer coefficient on the endwall was the highest for Tetrakaidecahedron lattice whereas Rhombic dodecahedron lattice exhibited the highest average interfacial heat transfer coefficients on the struts. Flow analysis showed the presence of strong secondary flow features on planes normal to the mean flow direction that demonstrated the unique flow mixing capabilities of these lattices. Reported interfacial heat transfer coefficient at struts and endwall can be used in volume-averaged computations of metal foams (representative of lattices' flow and thermal properties) under local thermal non-equilibrium.
期刊介绍:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.