{"title":"模块封装用陶瓷插入器的研制","authors":"R. Alizadeh, Kaoru Porter, T. Cannon, S. Ang","doi":"10.4071/imaps.1114553","DOIUrl":null,"url":null,"abstract":"Abstract In this study, low-temperature cofired ceramic (LTCC) and 3D-printed ceramic interposers are designed and fabricated for a double-sided power electronic module. The interposer acts as elec...","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"17 1","pages":"67-72"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Fabrication of Ceramic Interposers for Module Packaging\",\"authors\":\"R. Alizadeh, Kaoru Porter, T. Cannon, S. Ang\",\"doi\":\"10.4071/imaps.1114553\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract In this study, low-temperature cofired ceramic (LTCC) and 3D-printed ceramic interposers are designed and fabricated for a double-sided power electronic module. The interposer acts as elec...\",\"PeriodicalId\":35312,\"journal\":{\"name\":\"Journal of Microelectronics and Electronic Packaging\",\"volume\":\"17 1\",\"pages\":\"67-72\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectronics and Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/imaps.1114553\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/imaps.1114553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
Fabrication of Ceramic Interposers for Module Packaging
Abstract In this study, low-temperature cofired ceramic (LTCC) and 3D-printed ceramic interposers are designed and fabricated for a double-sided power electronic module. The interposer acts as elec...
期刊介绍：
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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