硅表面水-乙醇液滴的分子动力学模拟

IF 1 Q4 ENGINEERING, CHEMICAL Chemical Product and Process Modeling Pub Date : 2023-03-07 DOI:10.1515/cppm-2022-0040
R. Biswas
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引用次数: 0

摘要

摘要分子动力学模拟用于探索水-乙醇液滴在硅表面的润湿行为。通过接触角的计算,分析了乙醇浓度对水-乙醇液滴在硅表面润湿性的影响。在30%乙醇浓度下,水接触角为50.7°,而在50%乙醇浓度下为36°。结果表明,液滴在硅表面的接触角随着乙醇浓度的增加而减小。对于30%的乙醇体系,水-水分子之间形成的氢键(HBs)为677,而在50%的乙醇浓度下,形成的氢键为141。水分子之间的氢键数量随着乙醇浓度的升高而减少。水分子和硅表面之间的HBs随着乙醇浓度的升高而生长。纯水、7:3水-乙醇和1:1水-乙醇体系的总势能分别为−74.4、−96.16和−158.59 kcal/mol。水分子在硅表面的接触角和数量密度表明,在不同的乙醇浓度下,更多的水分子分布在硅表面。
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Molecular dynamics simulations of water-ethanol droplet on silicon surface
Abstract Molecular dynamics simulations are used to explore the wetting behavior of a water-ethanol droplet on the silicon surface. The effect of ethanol concentration on the wettability of a water-ethanol droplet on the silicon surface was analysed by calculation of contact angle. At 30% ethanol concentrations, the water contact angle was 50.7°, while at 50% ethanol concentrations, it was 36°. The results showed that the contact angle of a droplet on a silicon surface decreases with increasing ethanol concentrations. The formation of hydrogen bonds (HBs) between water-water molecules was 677 for the 30% ethanol system, while at 50% ethanol concentrations, it was 141. The number of hydrogen bonds between water molecules reduces as the ethanol concentrations rise. The HBs between water molecules and the silicon surface is seen to grow as the ethanol concentration rises. The overall potential energies of pure water, 7:3 water-ethanol, and 1:1 water-ethanol systems are −74.4, −96.16, and −158.59 kcal/mol, respectively. The contact angle and number density of water molecules on the surface of the silicon revealed that at different ethanol concentrations, more water molecules are distributed on the silicon surface.
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来源期刊
Chemical Product and Process Modeling
Chemical Product and Process Modeling ENGINEERING, CHEMICAL-
CiteScore
2.10
自引率
11.10%
发文量
27
期刊介绍: Chemical Product and Process Modeling (CPPM) is a quarterly journal that publishes theoretical and applied research on product and process design modeling, simulation and optimization. Thanks to its international editorial board, the journal assembles the best papers from around the world on to cover the gap between product and process. The journal brings together chemical and process engineering researchers, practitioners, and software developers in a new forum for the international modeling and simulation community. Topics: equation oriented and modular simulation optimization technology for process and materials design, new modeling techniques shortcut modeling and design approaches performance of commercial and in-house simulation and optimization tools challenges faced in industrial product and process simulation and optimization computational fluid dynamics environmental process, food and pharmaceutical modeling topics drawn from the substantial areas of overlap between modeling and mathematics applied to chemical products and processes.
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