Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
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High Gain and Wideband Antenna-in-package Solution Using Fan-out Technology
The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave Antenna-in-Package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using FOWLP technology generally form antenna pattern on Redistribution Layer, which brings design inconvenience. In our work, a low-cost PCB antenna with relatively large size is integrated, forms three-dimensional stacked structure. The AiP employs right angle transition board embedded in Epoxy molding compound (EMC), which transmits mm-wave signal to the substrate-integrated waveguide (SIW) antenna stacked on the back of EMC. The SIW antenna consists of 4x4 radiation slots with modified magnetoelectric dipole for bandwidth enhancement. Measured gain is 14dBi at 60GHz with bandwidth beyond 55-65GHz. The SIW antenna works also as heat sink, no extra thermal design is needed for 0.5W power consumption. The AiP module is manufactured and measured on circuit board. The proposed approach is a convenient solution for wide band and high gain millimeter wave AiP system integration.
期刊介绍：
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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