Ardalan Nasiri, S. Ang, T. Cannon, E. Porter, Kaoru Porter, C. Chapin, Ruiqi Chen, D. Senesky
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High-Temperature Electronics Packaging for Simulated Venus Condition
Abstract An electronic packaging technology that survives the simulated Venusian surface temperature of 465°C and 96 bar pressure in carbon dioxide (CO2) and nitrogen environments, without the corr...
期刊介绍：
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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