{"title":"超高频RFID温度传感器芯片的结构特点及技术趋势","authors":"Guofeng Zhang, Dehua Wu, Jingdun Jia, W. Gao, Qiang Cai, Wan’ang Xiao, Lina Yu, Sha Tao, Qi Chu","doi":"10.1155/2018/9343241","DOIUrl":null,"url":null,"abstract":"The integration of temperature sensor (TS) and UHF RFID technology has attracted wide attention theoretically and experimentally. The architecture, power consumption, temperature measurement range, accuracy, and communication distance are key indicators of the performance of UHF RFID temperature sensor chip (RID-TSC). This work aims to provide a clearer view of the development of UHF RFID-TSC integration technology. After a systematic analysis of the characteristics of ADC, TDC, and FDC used in an integrated TS, the key low-power technologies under different architectures are summarized. Through the observation of the latest researches and commercial products, the development trend of UHF RFID-TSC technology is obtained, including on-chip and off-chip coordination, multiprotocol and multifrequency support, passive wireless sensor intelligence, miniaturization, and concealment.","PeriodicalId":43355,"journal":{"name":"Active and Passive Electronic Components","volume":" ","pages":""},"PeriodicalIF":1.3000,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2018/9343241","citationCount":"7","resultStr":"{\"title\":\"Architecture Characteristics and Technical Trends of UHF RFID Temperature Sensor Chip\",\"authors\":\"Guofeng Zhang, Dehua Wu, Jingdun Jia, W. Gao, Qiang Cai, Wan’ang Xiao, Lina Yu, Sha Tao, Qi Chu\",\"doi\":\"10.1155/2018/9343241\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The integration of temperature sensor (TS) and UHF RFID technology has attracted wide attention theoretically and experimentally. The architecture, power consumption, temperature measurement range, accuracy, and communication distance are key indicators of the performance of UHF RFID temperature sensor chip (RID-TSC). This work aims to provide a clearer view of the development of UHF RFID-TSC integration technology. After a systematic analysis of the characteristics of ADC, TDC, and FDC used in an integrated TS, the key low-power technologies under different architectures are summarized. Through the observation of the latest researches and commercial products, the development trend of UHF RFID-TSC technology is obtained, including on-chip and off-chip coordination, multiprotocol and multifrequency support, passive wireless sensor intelligence, miniaturization, and concealment.\",\"PeriodicalId\":43355,\"journal\":{\"name\":\"Active and Passive Electronic Components\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":1.3000,\"publicationDate\":\"2018-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1155/2018/9343241\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Active and Passive Electronic Components\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1155/2018/9343241\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Active and Passive Electronic Components","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1155/2018/9343241","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Architecture Characteristics and Technical Trends of UHF RFID Temperature Sensor Chip
The integration of temperature sensor (TS) and UHF RFID technology has attracted wide attention theoretically and experimentally. The architecture, power consumption, temperature measurement range, accuracy, and communication distance are key indicators of the performance of UHF RFID temperature sensor chip (RID-TSC). This work aims to provide a clearer view of the development of UHF RFID-TSC integration technology. After a systematic analysis of the characteristics of ADC, TDC, and FDC used in an integrated TS, the key low-power technologies under different architectures are summarized. Through the observation of the latest researches and commercial products, the development trend of UHF RFID-TSC technology is obtained, including on-chip and off-chip coordination, multiprotocol and multifrequency support, passive wireless sensor intelligence, miniaturization, and concealment.
期刊介绍：
Active and Passive Electronic Components is an international journal devoted to the science and technology of all types of electronic components. The journal publishes experimental and theoretical papers on topics such as transistors, hybrid circuits, integrated circuits, MicroElectroMechanical Systems (MEMS), sensors, high frequency devices and circuits, power devices and circuits, non-volatile memory technologies such as ferroelectric and phase transition memories, and nano electronics devices and circuits.
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