Masaya Toba, S. Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, S. Abe, T. Masuko, Kazuhiko Kurafuchi
{"title":"利用UV改性和高频传输特性的低衰减组装具有超光滑高粘附性的化学镀铜籽晶层的铜布线","authors":"Masaya Toba, S. Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, S. Abe, T. Masuko, Kazuhiko Kurafuchi","doi":"10.4071/imaps.1100914","DOIUrl":null,"url":null,"abstract":"Abstract Semiconductor packages for high-performance devices with printed circuit boards having multiwiring layers such as flip-chip ball grid array have been attracting the attention to realize ul...","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"17 1","pages":"45-51"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property\",\"authors\":\"Masaya Toba, S. Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, S. Abe, T. Masuko, Kazuhiko Kurafuchi\",\"doi\":\"10.4071/imaps.1100914\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract Semiconductor packages for high-performance devices with printed circuit boards having multiwiring layers such as flip-chip ball grid array have been attracting the attention to realize ul...\",\"PeriodicalId\":35312,\"journal\":{\"name\":\"Journal of Microelectronics and Electronic Packaging\",\"volume\":\"17 1\",\"pages\":\"45-51\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectronics and Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/imaps.1100914\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/imaps.1100914","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property
Abstract Semiconductor packages for high-performance devices with printed circuit boards having multiwiring layers such as flip-chip ball grid array have been attracting the attention to realize ul...
期刊介绍：
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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