纳米烧结铜接头的有效本构关系

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2022-10-28 DOI:10.1115/1.4056113
S. Thekkut, R. Sivasubramony, A. Raj, Yuki Kawana, Jones Assiedu, K. Mirpuri, N. Shahane, P. Thompson, P. Borgesen
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引用次数: 1

摘要

烧结铜纳米粒子被认为是不同应用中焊料和/或烧结银的替代品。然而,与替代方案一样,对加速疲劳试验结果的解释也需要建模,通常包括基于本构关系预测应力和应变与时间和温度的关系。这带来了挑战,因为非弹性变形特性强烈依赖于初始颗粒和加工细节,即与焊料不同,一般的本构关系是不可能的。本工作提供了与循环相关的早期瞬态蠕变的机制描述,包括烧结参数和随后氧化的影响。非弹性变形主要由扩散而非位错运动控制。提供了广义本构关系,使得特定结构的定量建模只需要测量单个蠕变曲线。
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Effective Constitutive Relations for Sintered Nano Copper Joints
Sintered copper nano particles are being considered as alternatives to solder and/or sintered silver in different applications. Like for the alternatives, interpretation of accelerated fatigue test results does however require modeling, typically involving prediction of stresses and strains vs. time and temperature based on constitutive relations. This poses a challenge as the inelastic deformation properties depend strongly on both the initial particles and details of the processing, i.e. unlike for solder general constitutive relations are not possible. The present work provides a mechanistic description of the early transient creep of relevance in cycling, including effects of sintering parameters and subsequent oxidation. Inelastic deformation is dominated by diffusion, rather than dislocation motion. Generalized constitutive relations are provided to the extent that quantitative modeling of a specific structure only requires the measurement of a single creep curve for that.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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