基于LTCC技术的可共烧陶瓷/玻璃材料电容式压力传感器

Yue Liu, Yuanxun Li, Yongcheng Lu, Hua Su, Zhihua Tao, Mingzhou Chen, Daming Chen
{"title":"基于LTCC技术的可共烧陶瓷/玻璃材料电容式压力传感器","authors":"Yue Liu, Yuanxun Li, Yongcheng Lu, Hua Su, Zhihua Tao, Mingzhou Chen, Daming Chen","doi":"10.4071/imaps.926920","DOIUrl":null,"url":null,"abstract":"\n Because of good thermal, electrical, and mechanical properties, low-temperature cofired ceramic (LTCC) has shown great potential in microelectronic applications. One of the most promising directions of LTCC technology development are integrating and packing sensors. In this article, a wireless passive capacitive pressure sensor operating in the MHz range based on cofiring of heterogeneous materials with LTCC technology is proposed, and the design, simulation, and fabrication of the sensor are demonstrated and discussed. It consists of a circular spiral inductor and a capacitor of two electrodes separated by a glass medium. Furthermore, a unique process of cofiring of heterogeneous materials was introduced to avoid deformation of the capacitive embedded cavity during lamination or sintering. The results show that the inductance of the inductor and the capacitance of the capacitor embedded in the sensor are .28 μH and 16.80 pF, respectively. The novel sensor has a sensitivity of approximately 847 Hz/MPa within the pressure range from atmospheric pressure to 100 MPa.","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A Capacitive Pressure Sensor Based on Cofirable Ceramic/Glass Materials with LTCC Technology\",\"authors\":\"Yue Liu, Yuanxun Li, Yongcheng Lu, Hua Su, Zhihua Tao, Mingzhou Chen, Daming Chen\",\"doi\":\"10.4071/imaps.926920\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Because of good thermal, electrical, and mechanical properties, low-temperature cofired ceramic (LTCC) has shown great potential in microelectronic applications. One of the most promising directions of LTCC technology development are integrating and packing sensors. In this article, a wireless passive capacitive pressure sensor operating in the MHz range based on cofiring of heterogeneous materials with LTCC technology is proposed, and the design, simulation, and fabrication of the sensor are demonstrated and discussed. It consists of a circular spiral inductor and a capacitor of two electrodes separated by a glass medium. Furthermore, a unique process of cofiring of heterogeneous materials was introduced to avoid deformation of the capacitive embedded cavity during lamination or sintering. The results show that the inductance of the inductor and the capacitance of the capacitor embedded in the sensor are .28 μH and 16.80 pF, respectively. The novel sensor has a sensitivity of approximately 847 Hz/MPa within the pressure range from atmospheric pressure to 100 MPa.\",\"PeriodicalId\":35312,\"journal\":{\"name\":\"Journal of Microelectronics and Electronic Packaging\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-09-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectronics and Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/imaps.926920\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/imaps.926920","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 1

摘要

低温共烧陶瓷(LTCC)具有良好的热、电和机械性能,在微电子应用中显示出巨大的潜力。LTCC技术发展最有前景的方向之一是集成和封装传感器。本文提出了一种基于异质材料共烧和LTCC技术的工作在MHz范围内的无线无源电容式压力传感器,并对传感器的设计、仿真和制造进行了演示和讨论。它由一个圆形螺旋电感器和一个由玻璃介质分隔的两个电极组成的电容器组成。此外,引入了一种独特的异质材料共烧工艺,以避免电容嵌入腔在层压或烧结过程中变形。结果表明,嵌入传感器的电感和电容分别为.28μH和16.80 pF。该新型传感器在从大气压到100MPa的压力范围内具有大约847Hz/MPa的灵敏度。
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A Capacitive Pressure Sensor Based on Cofirable Ceramic/Glass Materials with LTCC Technology
Because of good thermal, electrical, and mechanical properties, low-temperature cofired ceramic (LTCC) has shown great potential in microelectronic applications. One of the most promising directions of LTCC technology development are integrating and packing sensors. In this article, a wireless passive capacitive pressure sensor operating in the MHz range based on cofiring of heterogeneous materials with LTCC technology is proposed, and the design, simulation, and fabrication of the sensor are demonstrated and discussed. It consists of a circular spiral inductor and a capacitor of two electrodes separated by a glass medium. Furthermore, a unique process of cofiring of heterogeneous materials was introduced to avoid deformation of the capacitive embedded cavity during lamination or sintering. The results show that the inductance of the inductor and the capacitance of the capacitor embedded in the sensor are .28 μH and 16.80 pF, respectively. The novel sensor has a sensitivity of approximately 847 Hz/MPa within the pressure range from atmospheric pressure to 100 MPa.
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来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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