P. Neudeck, D. Spry, M. Krasowski, N. Prokop, G. Beheim, Liangyu Chen, Carl W. Chang
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Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits
This work describes recent progress in the design, processing, and testing of significantly up-scaled complex 500°C–durable 4H-SiC junction field effect transistor (JFET) integrated circuit (IC) technology with two-level interconnect undergoing development at NASA Glenn Research Center. For the first time, stable electrical operation of semiconductor ICs for more than 1 y at 500°C in an air atmosphere is reported. These groundbreaking durability results were attained on two-level interconnect JFET demonstration ICs with 175 or more transistors on each chip. This corresponds to a more than 7-fold increase in 500°C–durable circuit complexity from the 24-transistor ring oscillator ICs reported at HiTEC 2016. These results advance the technology foundation for realizing long-term durable 500°C ICs with increased functional capability for combustion engine sensing and control, planetary exploration, deep-well drilling monitoring, and other harsh-environment applications.
期刊介绍:
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.